link to page 8 link to page 8 ADuM5400Data SheetPIN CONFIGURATION AND FUNCTION DESCRIPTIONSVDD1 116 VISOGND1 215 GNDISOVIA 314 VOAADuM5400VIB 413 VOBTOP VIEWV(Not to Scale)IC512 VOCVID 611 VODVDDL 710 VISO 004 GND1 89GNDISO 07509- Figure 3. Pin Configuration Table 12. Pin Function Descriptions Pin No.MnemonicDescription 1 V Primary Supply Voltage, 4.5 V to 5.5 V. DD1 2, 8 GND Ground 1. Ground reference for isolator primary. Pin 2 and Pin 8 are internally connected to each other, 1 and it is recommended that both pins be connected to a common ground. 3 V Logic Input A. IA 4 V Logic Input B. IB 5 V Logic Input C. IC 6 V Logic Input D. ID 7 V Logic Power Supply Voltage. This pin must be connected to V and have a dedicated bypass capacitor. DDL DD1 9, 15 GND Ground Reference for Isolator Side 2. Pin 9 and Pin 15 are internally connected to each other, and it is ISO recommended that both pins be connected to a common ground. 10, 16 V Secondary Supply Voltage Output for External Loads, 5.0 V. These pins are not tied together internally ISO and must be connected together on the PCB. 11 V Logic Output D. OD 12 V Logic Output C. OC 13 V Logic Output B. OB 14 V Logic Output A. OA Table 13. Truth Table (Positive Logic) V Input1V/VStateV/VInput (V) V StateV Output (V)V Output1OperationIxDD1DDLDD1DDLISOISOOx High Powered 5.0 Powered 5.0 High Normal operation, data is high Low Powered 5.0 Powered 5.0 Low Normal operation, data is low 1 VIx and VOx refer to the input and output signals of a given channel (A, B, C, or D). Rev. B | Page 8 of 16 Document Outline Features Applications General Description Functional Block Diagram Table of Contents Revision History Specifications Electrical Characteristics Package Characteristics Regulatory Information Insulation and Safety Related Specifications IEC 60747-5-2 (VDE 0884, Part 2):2003-01 Insulation Characteristics Recommended Operating Conditions Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Terminology Applications Information PCB Layout EMI Considerations Propagation Delay Parameters DC Correctness and Magnetic Field Immunity Power Consumption Power Considerations Thermal Analysis Insulation Lifetime Outline Dimensions Ordering Guide