Datasheet ADR512 (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | 1.2 V Precision Low Noise Shunt Voltage Reference |
| Pages / Page | 12 / 4 — ADR512. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table … |
| Revision | A |
| File Format / Size | PDF / 282 Kb |
| Document Language | English |
ADR512. Data Sheet. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 3. Parameter. Rating. Table 4. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
ADR512 Data Sheet ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Reverse Current 25 mA soldered in a circuit board for surface-mount packages. Forward Current 20 mA
Table 4. Thermal Resistance
Storage Temperature Range
Package Type1 θ 2 JA θJC Unit
RT Package −65°C to +150°C 3-SOT-23 (RT) 230 146 °C/W Operating Temperature Range −40°C to +85°C Junction Temperature Range 1Package power dissipation = (TJMAX − TA)/θJA. 2 RT Package −65°C to +150°C θJA is specified for worst-case conditions, i.e., θJA is specified for device soldered. Lead Temperature Range (Soldering, 60 Sec) 300°C
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 4 of 12 Document Outline Features Applications Pin Configuration General Description Revision History Specifications Electrical Characteristics Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Parameter Definitions Temperature Coefficient Thermal Hysteresis Applications Section Adjustable Precision Voltage Source Output Voltage Trim Using the ADR512 with Precision Data Converters Precise Negative Voltage Reference Outline Dimensions Ordering Guide
θJA is specified for the worst-case conditions, that is, a device Reverse Current 25 mA soldered in a circuit board for surface-mount packages. Forward Current 20 mA
Table 4. Thermal Resistance
Storage Temperature Range
Package Type1 θ 2 JA θJC Unit
RT Package −65°C to +150°C 3-SOT-23 (RT) 230 146 °C/W Operating Temperature Range −40°C to +85°C Junction Temperature Range 1Package power dissipation = (TJMAX − TA)/θJA. 2 RT Package −65°C to +150°C θJA is specified for worst-case conditions, i.e., θJA is specified for device soldered. Lead Temperature Range (Soldering, 60 Sec) 300°C
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. A | Page 4 of 12 Document Outline Features Applications Pin Configuration General Description Revision History Specifications Electrical Characteristics Absolute Maximum Ratings Thermal Resistance ESD Caution Typical Performance Characteristics Parameter Definitions Temperature Coefficient Thermal Hysteresis Applications Section Adjustable Precision Voltage Source Output Voltage Trim Using the ADR512 with Precision Data Converters Precise Negative Voltage Reference Outline Dimensions Ordering Guide
