ADL5611Data SheetPIN CONFIGURATION AND FUNCTION DESCRIPTIONSRFIN 1ADL5611GND 2TOP VIEW(2) GND(Not to Scale)RFOUT 3NOTES1. THE EXPOSED PAD ENCOMPASSES PIN 2 AND THETAB AT THE TOP SIDE OF THE PACKAGE. SOLDERTHE EXPOSED PAD TO A LOW IMPEDANCE GROUND 002 PLANE FOR ELECTRICAL GROUNDING ANDTHERMAL TRANSFER. 11508- Figure 2. Pin Configuration Table 5. Pin Function Descriptions Pin No.MnemonicDescription 1 RFIN RF Input. This pin requires a dc blocking capacitor. 2 GND Ground. Connect this pin to a low impedance ground plane. 3 RFOUT RF Output and Supply Voltage. DC bias is provided to this pin through an inductor that is connected to the external power supply. The RF path requires a dc blocking capacitor. EPAD Exposed Pad. The exposed pad encompasses Pin 2 and the tab at the top side of the package. Solder the exposed pad to a low impedance ground plane for electrical grounding and thermal transfer. Rev. B | Page 8 of 16 Document Outline FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS TYPICAL SCATTERING PARAMETERS (S-PARAMETERS) ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS 500 MHz TO 6 GHz FREQUENCY BAND 30 MHz TO 500 MHz FREQUENCY BAND GENERAL APPLICATIONS INFORMATION BASIC CONNECTIONS SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN W-CDMA ACPR PERFORMANCE EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE