Data SheetADL5611TYPICAL PERFORMANCE CHARACTERISTICS 500 MHz TO 6 GHz FREQUENCY BAND4545) m40, dB40700MHz353 (dB900MHzOIP3 (dBm)30351900MHz, OIP2140MHz1dB252600MHz, PGAIN (dB)dBm) 30IN20IP3 (3500MHzP1dB (dBm)OE, GA5000MHz15R255800MHz4000MHz10E FIGU205OISNOISE FIGURE (dB)N0150.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 103 –5–3–1135 106 FREQUENCY (GHz) 11508- POUT PER TONE (dBm) 11508- Figure 3. Noise Figure, Gain, P1dB, and OIP3 vs. Frequency Figure 6. OIP3 vs. Output Power (POUT) and Frequency 250+25°C–520+85°CS22–40°C) –10B+105°C15S (d –15(dB)ERINMETS11GA10A –20RS-PA –25S125–300–350.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 104 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 107 FREQUENCY (GHz) 11508- FREQUENCY (GHz) 11508- Figure 4. Gain vs. Frequency and Temperature Figure 7. Output Return Loss (S22), Input Return Loss (S11), and Reverse Isolation (S12) vs. Frequency 454584040735356)30305E (dB+105°C2525R+85°CdBm)dBm)–40°C +25°C4+25°C20+85°C20B (IP3 (–40°CO+105°CP1dE FIGU 31515OIS N101025510000.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 105 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 108 FREQUENCY (GHz) 11508- FREQRE UENCUEY (GYHz)H 11508- Figure 5. OIP3 and P1dB vs. Frequency and Temperature Figure 8. Noise Figure vs. Frequency and Temperature Rev. B | Page 9 of 16 Document Outline FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS TYPICAL SCATTERING PARAMETERS (S-PARAMETERS) ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS 500 MHz TO 6 GHz FREQUENCY BAND 30 MHz TO 500 MHz FREQUENCY BAND GENERAL APPLICATIONS INFORMATION BASIC CONNECTIONS SOLDERING INFORMATION AND RECOMMENDED PCB LAND PATTERN W-CDMA ACPR PERFORMANCE EVALUATION BOARD OUTLINE DIMENSIONS ORDERING GUIDE