Datasheet HMC3587LP3BE (Analog Devices) - 7
| Manufacturer | Analog Devices |
| Description | HBT GAIN BLOCK MMIC AMPLIFIER, 4 - 10 GHz |
| Pages / Page | 8 / 7 — HMC3587LP3BE. HBT GAIN BLOCK. MMIC AMPLIFIER, 4 - 10 GHz. Evaluation PCB |
| File Format / Size | PDF / 506 Kb |
| Document Language | English |
HMC3587LP3BE. HBT GAIN BLOCK. MMIC AMPLIFIER, 4 - 10 GHz. Evaluation PCB
Model Line for this Datasheet
Text Version of Document
HMC3587LP3BE
v02.0717
HBT GAIN BLOCK MMIC AMPLIFIER, 4 - 10 GHz Evaluation PCB
T m s r - e w o p r & A e lin s - r ie lif p m
List of Material for Evaluation PCB 113589-HMC3587LP3B [1]
A item Description J1, J4 pCB mount smA rf Connector The circuit board used in the application should use C1 - C2 10 pf Capacitor, 0402 pkg. rf circuit design techniques. signal lines should C3 - C4 10000 pf Capacitor, 0603 pkg. have 50 ohm impedance while the package ground leads and exposed paddle should be connected C5 -C6 4.7 uf Capacitor, Tantalum. directly to the ground plane similar to that shown. U1 HmC3587lp3Be A sufficient number of via holes should be used to pCB [2] 111173-1 evaluation Board connect the top and bottom ground planes. The 1] reference this number when ordering complete evaluation pCB evaluation circuit board shown is available from [2] Circuit Board material: rogers 4350 or Arlon 25fr Analog Devices upon request. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
7
Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Second Harmonics vs. Pout Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Temperature @ Pout = 18 dBm Power Dissipation Power Compression @ 10 GHz Psat vs. Vdd P1dB vs. Vdd Psat vs. Temperature P1dB vs. Temperature Noise Figure vs. Frequency Output Return Loss vs. Temperature Input Return Loss vs. Temperature Gain vs. Temperature Gain & Return Loss Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit
v02.0717
HBT GAIN BLOCK MMIC AMPLIFIER, 4 - 10 GHz Evaluation PCB
T m s r - e w o p r & A e lin s - r ie lif p m
List of Material for Evaluation PCB 113589-HMC3587LP3B [1]
A item Description J1, J4 pCB mount smA rf Connector The circuit board used in the application should use C1 - C2 10 pf Capacitor, 0402 pkg. rf circuit design techniques. signal lines should C3 - C4 10000 pf Capacitor, 0603 pkg. have 50 ohm impedance while the package ground leads and exposed paddle should be connected C5 -C6 4.7 uf Capacitor, Tantalum. directly to the ground plane similar to that shown. U1 HmC3587lp3Be A sufficient number of via holes should be used to pCB [2] 111173-1 evaluation Board connect the top and bottom ground planes. The 1] reference this number when ordering complete evaluation pCB evaluation circuit board shown is available from [2] Circuit Board material: rogers 4350 or Arlon 25fr Analog Devices upon request. For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
7
Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Second Harmonics vs. Pout Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Temperature @ Pout = 18 dBm Power Dissipation Power Compression @ 10 GHz Psat vs. Vdd P1dB vs. Vdd Psat vs. Temperature P1dB vs. Temperature Noise Figure vs. Frequency Output Return Loss vs. Temperature Input Return Loss vs. Temperature Gain vs. Temperature Gain & Return Loss Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit
