Datasheet SSD1306 (Solomon Systech) - 9
| Manufacturer | Solomon Systech |
| Description | 128 x 64, Dot Matrix OLED/PLED Segment/Common Driver with Controller |
| Pages / Page | 64 / 9 — DIE PAD FLOOR PLAN. Figure 5-1 : SSD1306Z2 Die Drawing. Note. SSD1306. … |
| File Format / Size | PDF / 1.8 Mb |
| Document Language | English |
DIE PAD FLOOR PLAN. Figure 5-1 : SSD1306Z2 Die Drawing. Note. SSD1306. Pad 1,2,3,…->281. Solomon Systech
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Text Version of Document
5 DIE PAD FLOOR PLAN Figure 5-1 : SSD1306Z2 Die Drawing
Pad 1 Die Size (after 6.76mm +/- 0.05mm x sawing) 0.86mm +/- 0.05mm Die thickness 300 +/- 15um Min I/O pad pitch 60um Min SEG pad pitch 47um Min COM pad pitch 40um Bump height Nominal 12um Bump size Pad 1, 106, 124, 256 80um x 50um Pad 2-18, 89-105, 107-123, 257-273 25um x 80um SSD1306Z2 Pad 19-88 40um x 89um Pad 125-255 31um x 59um Pad 274-281 (TR pads) 30um x 50um Alignment Position Size mark + shape (-2973, 0) 75um x 75um + shape (2973, 0) 75um x 75um Circle (2466.665, 7.575) R37.5um, inner 18um SSL Logo (-2862.35, 144.82) - (For details dimension please see p.9 )
Note
(1) Diagram showing the Gold bumps face up. (2) Coordinates are referenced to center of the chip. (3) Coordinate units and size of all alignment marks are in um. (4) All alignment keys do not contain gold
Y X SSD1306 Pad 1,2,3,…->281
Gold Bumps face up
SSD1306
Rev 1.5 P 9/64 Aug 2010
Solomon Systech
Document Outline 1 GENERAL DESCRIPTION 2 FEATURES 3 ORDERING INFORMATION 4 BLOCK DIAGRAM 5 DIE PAD FLOOR PLAN 6 PIN ARRANGEMENT 6.1 SSD1306TR1 pin assignment 7 PIN DESCRIPTION 8 FUNCTIONAL BLOCK DESCRIPTIONS 8.1 MCU Interface selection 8.1.1 MCU Parallel 6800-series Interface 8.1.2 MCU Parallel 8080-series Interface 8.1.3 MCU Serial Interface (4-wire SPI) 8.1.4 MCU Serial Interface (3-wire SPI) 8.1.5 MCU I2C Interface 8.1.5.1 I2C-bus Write data 8.1.5.2 Write mode for I2C 8.2 Command Decoder 8.3 Oscillator Circuit and Display Time Generator 8.4 FR synchronization 8.5 Reset Circuit 8.6 Segment Drivers / Common Drivers 8.7 Graphic Display Data RAM (GDDRAM) 8.8 SEG/COM Driving block 8.9 Power ON and OFF sequence 8.9.1 Power ON and OFF sequence with External VCC 8.9.2 Power ON and OFF sequence with Charge Pump Application 8.10 Charge Pump Regulator 9 COMMAND TABLE 9.1 Data Read / Write 10 COMMAND DESCRIPTIONS 10.1 Fundamental Command 10.1.1 Set Lower Column Start Address for Page Addressing Mode (00h~0Fh) 10.1.2 Set Higher Column Start Address for Page Addressing Mode (10h~1Fh) 10.1.3 Set Memory Addressing Mode (20h) 10.1.4 Set Column Address (21h) 10.1.5 Set Page Address (22h) 10.1.6 Set Display Start Line (40h~7Fh) 10.1.7 Set Contrast Control for BANK0 (81h) 10.1.8 Set Segment Re-map (A0h/A1h) 10.1.9 Entire Display ON (A4h/A5h) 10.1.10 Set Normal/Inverse Display (A6h/A7h) 10.1.11 Set Multiplex Ratio (A8h) 10.1.12 Set Display ON/OFF (AEh/AFh) 10.1.13 Set Page Start Address for Page Addressing Mode (B0h~B7h) 10.1.14 Set COM Output Scan Direction (C0h/C8h) 10.1.15 Set Display Offset (D3h) 10.1.16 Set Display Clock Divide Ratio/ Oscillator Frequency (D5h) 10.1.17 Set Pre-charge Period (D9h) 10.1.18 Set COM Pins Hardware Configuration (DAh) 10.1.19 Set VCOMH Deselect Level (DBh) 10.1.20 NOP (E3h) 10.1.21 Status register Read 10.1.22 Charge Pump Setting (8Dh) 10.2 Graphic Acceleration Command 10.2.1 Horizontal Scroll Setup (26h/27h) 10.2.2 Continuous Vertical and Horizontal Scroll Setup (29h/2Ah) 10.2.3 Deactivate Scroll (2Eh) 10.2.4 Activate Scroll (2Fh) 10.2.5 Set Vertical Scroll Area(A3h) 10.3 Advance Graphic Command 10.3.1 Set Fade Out and Blinking (23h) 10.3.2 Set Zoom In (D6h) 11 MAXIMUM RATINGS 12 DC CHARACTERISTICS 13 AC CHARACTERISTICS 14 Application Example 15 PACKAGE INFORMATION 15.1 SSD1306TR1 Detail Dimension 15.2 SSD1306Z2 Die Tray Information
Pad 1 Die Size (after 6.76mm +/- 0.05mm x sawing) 0.86mm +/- 0.05mm Die thickness 300 +/- 15um Min I/O pad pitch 60um Min SEG pad pitch 47um Min COM pad pitch 40um Bump height Nominal 12um Bump size Pad 1, 106, 124, 256 80um x 50um Pad 2-18, 89-105, 107-123, 257-273 25um x 80um SSD1306Z2 Pad 19-88 40um x 89um Pad 125-255 31um x 59um Pad 274-281 (TR pads) 30um x 50um Alignment Position Size mark + shape (-2973, 0) 75um x 75um + shape (2973, 0) 75um x 75um Circle (2466.665, 7.575) R37.5um, inner 18um SSL Logo (-2862.35, 144.82) - (For details dimension please see p.9 )
Note
(1) Diagram showing the Gold bumps face up. (2) Coordinates are referenced to center of the chip. (3) Coordinate units and size of all alignment marks are in um. (4) All alignment keys do not contain gold
Y X SSD1306 Pad 1,2,3,…->281
Gold Bumps face up
SSD1306
Rev 1.5 P 9/64 Aug 2010
Solomon Systech
Document Outline 1 GENERAL DESCRIPTION 2 FEATURES 3 ORDERING INFORMATION 4 BLOCK DIAGRAM 5 DIE PAD FLOOR PLAN 6 PIN ARRANGEMENT 6.1 SSD1306TR1 pin assignment 7 PIN DESCRIPTION 8 FUNCTIONAL BLOCK DESCRIPTIONS 8.1 MCU Interface selection 8.1.1 MCU Parallel 6800-series Interface 8.1.2 MCU Parallel 8080-series Interface 8.1.3 MCU Serial Interface (4-wire SPI) 8.1.4 MCU Serial Interface (3-wire SPI) 8.1.5 MCU I2C Interface 8.1.5.1 I2C-bus Write data 8.1.5.2 Write mode for I2C 8.2 Command Decoder 8.3 Oscillator Circuit and Display Time Generator 8.4 FR synchronization 8.5 Reset Circuit 8.6 Segment Drivers / Common Drivers 8.7 Graphic Display Data RAM (GDDRAM) 8.8 SEG/COM Driving block 8.9 Power ON and OFF sequence 8.9.1 Power ON and OFF sequence with External VCC 8.9.2 Power ON and OFF sequence with Charge Pump Application 8.10 Charge Pump Regulator 9 COMMAND TABLE 9.1 Data Read / Write 10 COMMAND DESCRIPTIONS 10.1 Fundamental Command 10.1.1 Set Lower Column Start Address for Page Addressing Mode (00h~0Fh) 10.1.2 Set Higher Column Start Address for Page Addressing Mode (10h~1Fh) 10.1.3 Set Memory Addressing Mode (20h) 10.1.4 Set Column Address (21h) 10.1.5 Set Page Address (22h) 10.1.6 Set Display Start Line (40h~7Fh) 10.1.7 Set Contrast Control for BANK0 (81h) 10.1.8 Set Segment Re-map (A0h/A1h) 10.1.9 Entire Display ON (A4h/A5h) 10.1.10 Set Normal/Inverse Display (A6h/A7h) 10.1.11 Set Multiplex Ratio (A8h) 10.1.12 Set Display ON/OFF (AEh/AFh) 10.1.13 Set Page Start Address for Page Addressing Mode (B0h~B7h) 10.1.14 Set COM Output Scan Direction (C0h/C8h) 10.1.15 Set Display Offset (D3h) 10.1.16 Set Display Clock Divide Ratio/ Oscillator Frequency (D5h) 10.1.17 Set Pre-charge Period (D9h) 10.1.18 Set COM Pins Hardware Configuration (DAh) 10.1.19 Set VCOMH Deselect Level (DBh) 10.1.20 NOP (E3h) 10.1.21 Status register Read 10.1.22 Charge Pump Setting (8Dh) 10.2 Graphic Acceleration Command 10.2.1 Horizontal Scroll Setup (26h/27h) 10.2.2 Continuous Vertical and Horizontal Scroll Setup (29h/2Ah) 10.2.3 Deactivate Scroll (2Eh) 10.2.4 Activate Scroll (2Fh) 10.2.5 Set Vertical Scroll Area(A3h) 10.3 Advance Graphic Command 10.3.1 Set Fade Out and Blinking (23h) 10.3.2 Set Zoom In (D6h) 11 MAXIMUM RATINGS 12 DC CHARACTERISTICS 13 AC CHARACTERISTICS 14 Application Example 15 PACKAGE INFORMATION 15.1 SSD1306TR1 Detail Dimension 15.2 SSD1306Z2 Die Tray Information
