Preliminary Datasheet EPC2152 (Efficient Power Conversion) - 11
| Manufacturer | Efficient Power Conversion |
| Description | 80 V, 12.5 A ePower Stage |
| Pages / Page | 15 / 11 — EPC2152 – 80 V, 12.5 A ePower™ Stage. PRELIMINARY. Figure 7a: … |
| File Format / Size | PDF / 1.7 Mb |
| Document Language | English |
EPC2152 – 80 V, 12.5 A ePower™ Stage. PRELIMINARY. Figure 7a: Cross-Sectional View. Figure 7b: Perspective View
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EPC2152 – 80 V, 12.5 A ePower™ Stage PRELIMINARY
Top Side Cooling The attachment of a heatsink to the device The chip-scale packaging (CSP) of the can increase power throughput. Figure 7 EPC2152 device offers the possibility of six- shows a simple method to attach a heatsink sided cooling, with effective heat extraction to the EPC2152 CSP device. The approach from the bottom, top, and sides of the die. makes use of low profile threaded Designers can opt for using the device in stil mechanical SMD spacers (Würth Elektronik air or with airflow by simply using the Part Number 9774010243R) that are simply underlying PCB for heat dissipation. By soldered into the PCB. The spacer sets the mounting the device on a multi-layer PCB heatsink height above the board to 1 mm with 2 oz. copper using the recommended and when a compliant thermal interface layout guideline as demonstrated in the material is applied to the backside of the EPC90120 development board [2], the device, provides the correct compression device can operate continuously in stil air at and thermal interface impedance. The an ambient temperature of 25C under the heatsink can be mechanically fastened by operating conditions of VIN = 48 V, VOUT = 12 just inserting screws through the threads of V, IOUT = 10 A while switching the the SMD spacers. An increase of output synchronous buck converter at 1MHz. current capability up to +60% has been demonstrated using this method [3].
Figure 7a: Cross-Sectional View Figure 7b: Perspective View Figure 7: Recommended approach to attach a heatsink to the backside of the device
Subject to Change without Notice www.epc-co.com COPYRIGHT 2020 Rev 1.1 Page 11
Top Side Cooling The attachment of a heatsink to the device The chip-scale packaging (CSP) of the can increase power throughput. Figure 7 EPC2152 device offers the possibility of six- shows a simple method to attach a heatsink sided cooling, with effective heat extraction to the EPC2152 CSP device. The approach from the bottom, top, and sides of the die. makes use of low profile threaded Designers can opt for using the device in stil mechanical SMD spacers (Würth Elektronik air or with airflow by simply using the Part Number 9774010243R) that are simply underlying PCB for heat dissipation. By soldered into the PCB. The spacer sets the mounting the device on a multi-layer PCB heatsink height above the board to 1 mm with 2 oz. copper using the recommended and when a compliant thermal interface layout guideline as demonstrated in the material is applied to the backside of the EPC90120 development board [2], the device, provides the correct compression device can operate continuously in stil air at and thermal interface impedance. The an ambient temperature of 25C under the heatsink can be mechanically fastened by operating conditions of VIN = 48 V, VOUT = 12 just inserting screws through the threads of V, IOUT = 10 A while switching the the SMD spacers. An increase of output synchronous buck converter at 1MHz. current capability up to +60% has been demonstrated using this method [3].
Figure 7a: Cross-Sectional View Figure 7b: Perspective View Figure 7: Recommended approach to attach a heatsink to the backside of the device
Subject to Change without Notice www.epc-co.com COPYRIGHT 2020 Rev 1.1 Page 11
