Datasheet ADA4523-1 (Analog Devices) - 7
| Manufacturer | Analog Devices |
| Description | 36 V, Low Noise, Zero Drift Op Amp |
| Pages / Page | 29 / 7 — Data Sheet. ADA4523-1. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. … |
| File Format / Size | PDF / 939 Kb |
| Document Language | English |
Data Sheet. ADA4523-1. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 3. Parameter. Rating. Table 4. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
Data Sheet ADA4523-1 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 3. Parameter Rating
Thermal performance is directly linked to printed circuit board Supply Voltage, V+ to V− 40 V (PCB) design and operating environment. Careful attention to Input Voltage PCB thermal design is required. +IN and −IN1 V− − 0.3 V to V+ + 0.3 V θJA is the junction to ambient, thermal resistance. SD and SDCOM V− − 0.3 V to V+ + 0.3 V θJC is the junction to case, thermal resistance. For θJC on the Input Current exposed pad package, such as CP-8-29, heat sink applies to the +IN and −IN1 ±10 mA package bottom exposed pad only. SD and SDCOM ±10 mA Output Short-Circuit Duration2 Indefinite
Table 4. Thermal Resistance
Temperature Range
Package Type1 θJA θJC Unit
Operating −40°C to +125°C R-8 120 39 °C/W Junction −65°C to +150°C RM-8 163 40 °C/W Storage −65°C to +150°C CP-8-29 43 5.5 °C/W Lead Temperature, Soldering (10 sec) 300°C 1 Measured with JEDEC 4-layer high effective thermal conductivity board. Electrostatic Discharge (ESD) Human Body Model (HBM) 4.0 kV Field Induced Charge Device Model 2.0 kV
ESD CAUTION
(FICDM)3 1 Limit the input current to less than 10 mA. The input voltage must not exceed 300 mV beyond the power supply. These limits are set by the ESD protection structures at the input pins. 2 A heat sink may be required to keep the junction temperature below the absolute maximum rating when the output is shorted indefinitely. 3 JESD22-C101 (ESD FICDM standard of JEDEC) applicable standard. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 7 of 29 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION DIAGRAM COMPANION PRODUCTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 5 V ELECTRICAL CHARACTERISTICS 30 V ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INPUT VOLTAGE NOISE INPUT CURRENT NOISE INPUT BIAS CURRENT THERMOCOUPLE EFFECTS POWER DISSIPATION ELECTRICAL OVERSTRESS AND INPUT PROTECTION SHUTDOWN MODE APPLICATIONS INFORMATION PARALLELING CHOPPERS TO IMPROVE NOISE SOLDER PAD LAYOUTS TYPICAL APPLICATION CIRCUIT AND TRANSFER FUNCTION RELATED PRODUCTS OUTLINE DIMENSIONS ORDERING GUIDE
Thermal performance is directly linked to printed circuit board Supply Voltage, V+ to V− 40 V (PCB) design and operating environment. Careful attention to Input Voltage PCB thermal design is required. +IN and −IN1 V− − 0.3 V to V+ + 0.3 V θJA is the junction to ambient, thermal resistance. SD and SDCOM V− − 0.3 V to V+ + 0.3 V θJC is the junction to case, thermal resistance. For θJC on the Input Current exposed pad package, such as CP-8-29, heat sink applies to the +IN and −IN1 ±10 mA package bottom exposed pad only. SD and SDCOM ±10 mA Output Short-Circuit Duration2 Indefinite
Table 4. Thermal Resistance
Temperature Range
Package Type1 θJA θJC Unit
Operating −40°C to +125°C R-8 120 39 °C/W Junction −65°C to +150°C RM-8 163 40 °C/W Storage −65°C to +150°C CP-8-29 43 5.5 °C/W Lead Temperature, Soldering (10 sec) 300°C 1 Measured with JEDEC 4-layer high effective thermal conductivity board. Electrostatic Discharge (ESD) Human Body Model (HBM) 4.0 kV Field Induced Charge Device Model 2.0 kV
ESD CAUTION
(FICDM)3 1 Limit the input current to less than 10 mA. The input voltage must not exceed 300 mV beyond the power supply. These limits are set by the ESD protection structures at the input pins. 2 A heat sink may be required to keep the junction temperature below the absolute maximum rating when the output is shorted indefinitely. 3 JESD22-C101 (ESD FICDM standard of JEDEC) applicable standard. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 7 of 29 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION DIAGRAM COMPANION PRODUCTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 5 V ELECTRICAL CHARACTERISTICS 30 V ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INPUT VOLTAGE NOISE INPUT CURRENT NOISE INPUT BIAS CURRENT THERMOCOUPLE EFFECTS POWER DISSIPATION ELECTRICAL OVERSTRESS AND INPUT PROTECTION SHUTDOWN MODE APPLICATIONS INFORMATION PARALLELING CHOPPERS TO IMPROVE NOISE SOLDER PAD LAYOUTS TYPICAL APPLICATION CIRCUIT AND TRANSFER FUNCTION RELATED PRODUCTS OUTLINE DIMENSIONS ORDERING GUIDE
