Datasheet ADA4665-2-KGD (Analog Devices) - 8
| Manufacturer | Analog Devices |
| Description | 16 V, 1.2 MHz, CMOS Rail-to-Rail Input/Output Operational Amplifier |
| Pages / Page | 8 / 8 — ADA4665-2-KGD. Known Good Die. OUTLINE DIMENSIONS. 1.390. 0.541. 0.3048. … |
| File Format / Size | PDF / 211 Kb |
| Document Language | English |
ADA4665-2-KGD. Known Good Die. OUTLINE DIMENSIONS. 1.390. 0.541. 0.3048. 0.888. 0.604. 0.713. 2.085. 0.331. 0.337. 0.583. 0.070 × 0.070. TOP VIEW
Model Line for this Datasheet
Text Version of Document
ADA4665-2-KGD Known Good Die OUTLINE DIMENSIONS 1.390 0.541 0.541 0.3048 1 8 0.888 2 0.604 0.713 3 2.085 0.331 0.337 0.583 7 0.888 0.888 6 4 5 0.070 × 0.070 TOP VIEW SIDE VIEW A (Pads 1-8) (CIRCUIT SIDE) 2019- 11- 03-
Figure 2. 8-Pad Bare Die [CHIP] (C-8-18) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Chip Size 1310 × 2015 µm Scribe Line Width 80 µm Die Size 1390 × 2085 µm Thickness 305 µm Backside Negative supply Not applicable Passivation 1 (oxynitride) µm Bond Pads (Minimum) 70 × 70 µm Bond Pad Composition 99.5 aluminum (Al)/0.5 copper (Cu) %
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Hitachi CEL 9240HF10AK Bonding Method Gold ball or aluminum wedge Bonding Sequence Unspecified
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
ADA4665-2-KGD-WP −40°C to +125°C 8-Pad Bare Die [CHIP], Waffle Pack C-8-18 1 Z = RoHS Compliant Part.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D20271-0-10/19(0)
Rev. 0 | Page 8 of 8 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS—16 V OPERATION ELECTRICAL CHARACTERISTICS—5 V OPERATION ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
Figure 2. 8-Pad Bare Die [CHIP] (C-8-18) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 5. Die Specifications Parameter Value Unit
Chip Size 1310 × 2015 µm Scribe Line Width 80 µm Die Size 1390 × 2085 µm Thickness 305 µm Backside Negative supply Not applicable Passivation 1 (oxynitride) µm Bond Pads (Minimum) 70 × 70 µm Bond Pad Composition 99.5 aluminum (Al)/0.5 copper (Cu) %
Table 6. Assembly Recommendations Assembly Component Recommendation
Die Attach Hitachi CEL 9240HF10AK Bonding Method Gold ball or aluminum wedge Bonding Sequence Unspecified
ORDERING GUIDE Model1 Temperature Range Package Description Package Option
ADA4665-2-KGD-WP −40°C to +125°C 8-Pad Bare Die [CHIP], Waffle Pack C-8-18 1 Z = RoHS Compliant Part.
©2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D20271-0-10/19(0)
Rev. 0 | Page 8 of 8 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS—16 V OPERATION ELECTRICAL CHARACTERISTICS—5 V OPERATION ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTION OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
