Datasheet HMC862A (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | 0.1 GHz to 24 GHz, Low Noise, Programmable Divider |
| Pages / Page | 15 / 5 — Data Sheet. HMC862A. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL … |
| Revision | A |
| File Format / Size | PDF / 483 Kb |
| Document Language | English |
Data Sheet. HMC862A. ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE. Parameter Rating. Table 4. Package Type
Model Line for this Datasheet
Text Version of Document
Data Sheet HMC862A ABSOLUTE MAXIMUM RATINGS Table 3. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board RF Input Power (IN, IN) 13 dBm (PCB) design and operating environment. Careful attention to Supply Voltage (V PCB thermal design is required. CC) 5.5 V Logic Inputs (S0, S1, S2) −0.5 V to (0.5 V + VCC) Thermal impedance simulated values are based on the use of Storage Temperature Range −65°C to +125°C the EV1HMC862ALP3 evaluation board with the exposed pad Reflow Temperature 260°C soldered to GND. VCC = 5 V and Divider Ratio (N) = 8. Operating Temperature Range (TA) −40°C to +85°C Electrostatic Discharge (ESD) Sensitivity
Table 4.
Human Body Model (HBM), JS-001-2012 Class 2
Package Type Thermal Impedance (θJB) Unit
Field Induced Charged Device Model Class C3 HCP-16-1 34 °C/W (FICDM), JS-002 Stresses at or above those listed under Absolute Maximum
ESD CAUTION
Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 5 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS RF SPECIFICATIONS DC SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS DIVIDE BY 1 DIVIDE BY 2 DIVIDE BY 4 DIVIDE BY 8 CURRENT CONSUMPTION (ICC) THEORY OF OPERATION INPUT INTERFACE OUTPUT INTERFACE APPLICATIONS INFORMATION EVALUATION PRINTED CIRCUIT BOARD (PCB) EVALUATION BOARD OVERVIEW OUTLINE DIMENSIONS ORDERING GUIDE
Thermal performance is directly linked to printed circuit board RF Input Power (IN, IN) 13 dBm (PCB) design and operating environment. Careful attention to Supply Voltage (V PCB thermal design is required. CC) 5.5 V Logic Inputs (S0, S1, S2) −0.5 V to (0.5 V + VCC) Thermal impedance simulated values are based on the use of Storage Temperature Range −65°C to +125°C the EV1HMC862ALP3 evaluation board with the exposed pad Reflow Temperature 260°C soldered to GND. VCC = 5 V and Divider Ratio (N) = 8. Operating Temperature Range (TA) −40°C to +85°C Electrostatic Discharge (ESD) Sensitivity
Table 4.
Human Body Model (HBM), JS-001-2012 Class 2
Package Type Thermal Impedance (θJB) Unit
Field Induced Charged Device Model Class C3 HCP-16-1 34 °C/W (FICDM), JS-002 Stresses at or above those listed under Absolute Maximum
ESD CAUTION
Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. A | Page 5 of 15 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS RF SPECIFICATIONS DC SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS DIVIDE BY 1 DIVIDE BY 2 DIVIDE BY 4 DIVIDE BY 8 CURRENT CONSUMPTION (ICC) THEORY OF OPERATION INPUT INTERFACE OUTPUT INTERFACE APPLICATIONS INFORMATION EVALUATION PRINTED CIRCUIT BOARD (PCB) EVALUATION BOARD OVERVIEW OUTLINE DIMENSIONS ORDERING GUIDE
