Datasheet HMC434 (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | 0.2 GHz to 8 GHz, GaAs, HBT MMIC, Divide by 8 Prescaler |
| Pages / Page | 9 / 4 — HMC434. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. … |
| Revision | G |
| File Format / Size | PDF / 348 Kb |
| Document Language | English |
HMC434. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating. Table 3. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
HMC434 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Supply Voltage (VCC) −0.3 V to +3.5 V (PCB) design and operating environment. Careful attention to RF Input Power (VCC = 3 V) 13 dBm PCB thermal design is required. Temperature θJA is the natural convection junction to ambient thermal Operating −40°C to +85°C resistance measured in a one cubic foot sealed enclosure. θJC is Storage −65°C to +125°C the junction to case thermal resistance. Junction, TJ 135°C Nominal (TA = 85°C) 99°C
Table 3. Thermal Resistance
Reflow 260°C
Package Type θ 1 2 JA θJC Unit
ESD Sensitivity RJ-6 359 70 °C/W Human Body Model (HBM) Class 0 1 Simulated values per JEDEC JESD51-12 standards. 2 Junction to GND package pin. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these
ESD CAUTION
or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. G | Page 4 of 9 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Applications Information Evaluation Board PCB PCB Material Stackup Outline Dimensions Ordering Guide
Thermal performance is directly linked to printed circuit board Supply Voltage (VCC) −0.3 V to +3.5 V (PCB) design and operating environment. Careful attention to RF Input Power (VCC = 3 V) 13 dBm PCB thermal design is required. Temperature θJA is the natural convection junction to ambient thermal Operating −40°C to +85°C resistance measured in a one cubic foot sealed enclosure. θJC is Storage −65°C to +125°C the junction to case thermal resistance. Junction, TJ 135°C Nominal (TA = 85°C) 99°C
Table 3. Thermal Resistance
Reflow 260°C
Package Type θ 1 2 JA θJC Unit
ESD Sensitivity RJ-6 359 70 °C/W Human Body Model (HBM) Class 0 1 Simulated values per JEDEC JESD51-12 standards. 2 Junction to GND package pin. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these
ESD CAUTION
or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. G | Page 4 of 9 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Applications Information Evaluation Board PCB PCB Material Stackup Outline Dimensions Ordering Guide
