Datasheet T3902 (TDK) - 9
| Manufacturer | TDK |
| Description | Bottom Port PDM Low‐Power Multi‐Mode Microphone With High AOP Mode |
| Pages / Page | 22 / 9 — T3902. SOLDERING PROFILE . CRITICAL ZONE. TL TO TP. RAMP-UP. E T. SMAX. … |
| File Format / Size | PDF / 446 Kb |
| Document Language | English |
T3902. SOLDERING PROFILE . CRITICAL ZONE. TL TO TP. RAMP-UP. E T. SMAX. TU A R E. SMIN. M TE. PREHEAT. RAMP-DOWN. t25°C TO PEAK TEMPERATURE
Model Line for this Datasheet
Text Version of Document
T3902
SOLDERING PROFILE
CRITICAL ZONE tP TL TO TP TP RAMP-UP E T R L T tL SMAX TU A R E T P SMIN M TE tS PREHEAT RAMP-DOWN t25°C TO PEAK TEMPERATURE TIME
Figure 2. Recommended Soldering Profile Limits
TABLE 8. RECOMMENDED SOLDERING PROFILE* PROFILE FEATURE Sn63/Pb37 Pb‐Free
Average Ramp Rate (TL to TP) 1.25°C/sec max 1.25°C/sec max Minimum Temperature 100°C 100°C (TSMIN) Preheat Maximum 150°C 200°C Temperature (TSMAX) Time (TSMIN to TSMAX), tS 60 sec to 75 sec 60 sec to 75 sec Ramp‐Up Rate (TSMAX to TL) 1.25°C/sec 1.25°C/sec Time Maintained Above Liquidous (tL) 45 sec to 75 sec ~50 sec Liquidous Temperature (TL) 183°C 217°C Peak Temperature (TP) 215°C +3°C/−3°C 260°C +0°C/−5°C Time Within +5°C of Actual Peak 20 sec to 30 sec 20 sec to 30 sec Temperature (tP) Ramp‐Down Rate 3°C/sec max 3°C/sec max Time +25°C (t25°C) to Peak Temperature 5 min max 5 min max *The reflow profile in Table 8 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are also compatible with the J‐STD‐020 profile Page 9 of 22 Document Number: DS‐000357 Revision: 1.0
SOLDERING PROFILE
CRITICAL ZONE tP TL TO TP TP RAMP-UP E T R L T tL SMAX TU A R E T P SMIN M TE tS PREHEAT RAMP-DOWN t25°C TO PEAK TEMPERATURE TIME
Figure 2. Recommended Soldering Profile Limits
TABLE 8. RECOMMENDED SOLDERING PROFILE* PROFILE FEATURE Sn63/Pb37 Pb‐Free
Average Ramp Rate (TL to TP) 1.25°C/sec max 1.25°C/sec max Minimum Temperature 100°C 100°C (TSMIN) Preheat Maximum 150°C 200°C Temperature (TSMAX) Time (TSMIN to TSMAX), tS 60 sec to 75 sec 60 sec to 75 sec Ramp‐Up Rate (TSMAX to TL) 1.25°C/sec 1.25°C/sec Time Maintained Above Liquidous (tL) 45 sec to 75 sec ~50 sec Liquidous Temperature (TL) 183°C 217°C Peak Temperature (TP) 215°C +3°C/−3°C 260°C +0°C/−5°C Time Within +5°C of Actual Peak 20 sec to 30 sec 20 sec to 30 sec Temperature (tP) Ramp‐Down Rate 3°C/sec max 3°C/sec max Time +25°C (t25°C) to Peak Temperature 5 min max 5 min max *The reflow profile in Table 8 is recommended for board manufacturing with InvenSense MEMS microphones. All microphones are also compatible with the J‐STD‐020 profile Page 9 of 22 Document Number: DS‐000357 Revision: 1.0
