Datasheet ADCMP371-KGD (Analog Devices) - 6
| Manufacturer | Analog Devices |
| Description | General Purpose Comparators |
| Pages / Page | 6 / 6 — ADCMP371-KGD. Known Good Die. OUTLINE DIMENSIONS. 0.280. 0.600. 0.700. … |
| File Format / Size | PDF / 136 Kb |
| Document Language | English |
ADCMP371-KGD. Known Good Die. OUTLINE DIMENSIONS. 0.280. 0.600. 0.700. TOP VIEW. 0.076 × 0.076. SIDE VIEW. (CIRCUIT SIDE). 2015-. 05-. 03-
Model Line for this Datasheet
Text Version of Document
ADCMP371-KGD Known Good Die OUTLINE DIMENSIONS 0.280 0.600 1 2 3 0.700 6 4 5 A TOP VIEW 0.076 × 0.076 SIDE VIEW (CIRCUIT SIDE) 2015- 05- 03-
Figure 3. 6-Pad Bare Die [CHIP] (C-6-7) Dimensions shown in millimeter
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 4. Die Specifications Parameter Value Unit
Chip Size 520 × 620 µm Scribe Line Width 80 × 80 µm Die Size 600 × 700 µm (maximum) Thickness 280 µm Bond Pad 76 × 76 µm (minimum) Bond Pad Composition 98.5 Al, 0.5 Cu, 1 Si % Backside Bare Not applicable Passivation Nitride Not applicable
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy adhesive Bonding Method Gold ball or aluminum wedge Bonding Sequence Pin five first
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADCMP371-KGD-RL7 −40°C to +85°C 6-Pad Bare Die [CHIP] C-6-7
©2015 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D13037-0-4/15(0)
Rev. 0 | Page 6 of 6 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
Figure 3. 6-Pad Bare Die [CHIP] (C-6-7) Dimensions shown in millimeter
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 4. Die Specifications Parameter Value Unit
Chip Size 520 × 620 µm Scribe Line Width 80 × 80 µm Die Size 600 × 700 µm (maximum) Thickness 280 µm Bond Pad 76 × 76 µm (minimum) Bond Pad Composition 98.5 Al, 0.5 Cu, 1 Si % Backside Bare Not applicable Passivation Nitride Not applicable
Table 5. Assembly Recommendations Assembly Component Recommendation
Die Attach Epoxy adhesive Bonding Method Gold ball or aluminum wedge Bonding Sequence Pin five first
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADCMP371-KGD-RL7 −40°C to +85°C 6-Pad Bare Die [CHIP] C-6-7
©2015 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D13037-0-4/15(0)
Rev. 0 | Page 6 of 6 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS OUTLINE DIMENSIONS DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS ORDERING GUIDE
