Datasheet ADA4897-2-KGD (Analog Devices) - 10
| Manufacturer | Analog Devices |
| Description | 1 nV/√Hz, Low Power Operational Amplifier |
| Pages / Page | 10 / 10 — ADA4897-2-KGD. Known Good Die. OUTLINE DIMENSIONS. 0.483. 1.095. 10A. … |
| Revision | C |
| File Format / Size | PDF / 238 Kb |
| Document Language | English |
ADA4897-2-KGD. Known Good Die. OUTLINE DIMENSIONS. 0.483. 1.095. 10A. 1.445. 0.070 × 0.140. TOP VIEW. SIDE VIEW. 2015-. (CIRCUIT SIDE)
Model Line for this Datasheet
Text Version of Document
ADA4897-2-KGD Known Good Die OUTLINE DIMENSIONS 0.483 1.095 10 10A 1A 1 9 9A 1.445 2 3 8 4 7 4A 5 6 A 0.070 × 0.140 TOP VIEW SIDE VIEW 2015- (CIRCUIT SIDE) 0.070 × 0.070 09- 03-
Figure 2. 10-Pad Bare Die [CHIP] (C-10-6) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Die Specifications Parameter Value Unit
Scribe Line Width 75 μm Die Size (Maximum Size) 1095 × 1445 μm Thickness 483 μm Bond Pads (Minimum Size) 70 × 70 μm Bond Pad Composition 1% AlCu % Backside Si Not applicable Passivation Doped oxide/SiN Not applicable ESD HBM 2000 V
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach Ablestik 84-1LMIS R4 Bonding Method 1 mil gold
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADA4897-2-KGD −40°C to +125°C 10-Pad Bare Die [CHIP] C-10-6
©2014–2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12328-0-2/19(C)
Rev. C | Page 10 of 10 Document Outline Features Applications General Description Revision History Specifications ±5 V Supply +5 V Supply +3 V Supply Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide
Figure 2. 10-Pad Bare Die [CHIP] (C-10-6) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Die Specifications Parameter Value Unit
Scribe Line Width 75 μm Die Size (Maximum Size) 1095 × 1445 μm Thickness 483 μm Bond Pads (Minimum Size) 70 × 70 μm Bond Pad Composition 1% AlCu % Backside Si Not applicable Passivation Doped oxide/SiN Not applicable ESD HBM 2000 V
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach Ablestik 84-1LMIS R4 Bonding Method 1 mil gold
ORDERING GUIDE Model Temperature Range Package Description Package Option
ADA4897-2-KGD −40°C to +125°C 10-Pad Bare Die [CHIP] C-10-6
©2014–2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D12328-0-2/19(C)
Rev. C | Page 10 of 10 Document Outline Features Applications General Description Revision History Specifications ±5 V Supply +5 V Supply +3 V Supply Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide
