Datasheet IRFP450, SiHFP450 (Vishay) - 9
| Manufacturer | Vishay |
| Description | Power MOSFET |
| Pages / Page | 11 / 9 — Package Information. VERSION 2: FACILITY CODE = Y. MILLIMETERS. DIM. MIN. … |
| File Format / Size | PDF / 1.6 Mb |
| Document Language | English |
Package Information. VERSION 2: FACILITY CODE = Y. MILLIMETERS. DIM. MIN. MAX. NOTES. Notes
Model Line for this Datasheet
Text Version of Document
Package Information
www.vishay.com Vishay Siliconix
VERSION 2: FACILITY CODE = Y
A A 4 E B 7 ØP (Datum B) E/2 S A2 Ø k M D B M R/2 3 ØP1 A D2 Q 4 2 x R 4 D1 (2) D 1 2 3 D 4 Thermal pad L1 5 C L 4 E1 See view B A 0.01 M D B M 2 x b2 C View A - A 2 x e 3 x b b4 A1 0.10 M C A M (b1, b3, b5) Planting Base metal Lead Assignments 1. Gate D D E E 2. Drain (c) c1 3. Source C C 4. Drain (b, b2, b4) (4) Section C - C, D - D, E - E View B
MILLIMETERS MILLIMETERS DIM. MIN. MAX. NOTES DIM. MIN. MAX. NOTES
A 4.58 5.31 D2 0.51 1.30 A1 2.21 2.59 E 15.29 15.87 A2 1.17 2.49 E1 13.72 - b 0.99 1.40 e 5.46 BSC b1 0.99 1.35 Ø k 0.254 b2 1.53 2.39 L 14.20 16.25 b3 1.65 2.37 L1 3.71 4.29 b4 2.42 3.43 Ø P 3.51 3.66 b5 2.59 3.38 Ø P1 - 7.39 c 0.38 0.86 Q 5.31 5.69 c1 0.38 0.76 R 4.52 5.49 D 19.71 20.82 S 5.51 BSC D1 13.08 -
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994 (2) Contour of slot optional (3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body (4) Thermal pad contour optional with dimensions D1 and E1 (5) Lead finish uncontrolled in L1 (6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154") (7) Outline conforms to JEDEC outline TO-247 with exception of dimension c Revision: 19-Oct-2020
2
Document Number: 91360 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com Vishay Siliconix
VERSION 2: FACILITY CODE = Y
A A 4 E B 7 ØP (Datum B) E/2 S A2 Ø k M D B M R/2 3 ØP1 A D2 Q 4 2 x R 4 D1 (2) D 1 2 3 D 4 Thermal pad L1 5 C L 4 E1 See view B A 0.01 M D B M 2 x b2 C View A - A 2 x e 3 x b b4 A1 0.10 M C A M (b1, b3, b5) Planting Base metal Lead Assignments 1. Gate D D E E 2. Drain (c) c1 3. Source C C 4. Drain (b, b2, b4) (4) Section C - C, D - D, E - E View B
MILLIMETERS MILLIMETERS DIM. MIN. MAX. NOTES DIM. MIN. MAX. NOTES
A 4.58 5.31 D2 0.51 1.30 A1 2.21 2.59 E 15.29 15.87 A2 1.17 2.49 E1 13.72 - b 0.99 1.40 e 5.46 BSC b1 0.99 1.35 Ø k 0.254 b2 1.53 2.39 L 14.20 16.25 b3 1.65 2.37 L1 3.71 4.29 b4 2.42 3.43 Ø P 3.51 3.66 b5 2.59 3.38 Ø P1 - 7.39 c 0.38 0.86 Q 5.31 5.69 c1 0.38 0.76 R 4.52 5.49 D 19.71 20.82 S 5.51 BSC D1 13.08 -
Notes
(1) Dimensioning and tolerancing per ASME Y14.5M-1994 (2) Contour of slot optional (3) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outermost extremes of the plastic body (4) Thermal pad contour optional with dimensions D1 and E1 (5) Lead finish uncontrolled in L1 (6) Ø P to have a maximum draft angle of 1.5 to the top of the part with a maximum hole diameter of 3.91 mm (0.154") (7) Outline conforms to JEDEC outline TO-247 with exception of dimension c Revision: 19-Oct-2020
2
Document Number: 91360 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
