Datasheet ADA4098-1 (Analog Devices) - 4

ManufacturerAnalog Devices
Description50 V, 1 MHz, 165 µA, Robust Over-The-Top Precision Op Amp
Pages / Page27 / 4 — ADA4098-1. Preliminary Technical Data. B Grade. H-Grade. Parameter. Test …
RevisionPrA
File Format / SizePDF / 1.6 Mb
Document LanguageEnglish

ADA4098-1. Preliminary Technical Data. B Grade. H-Grade. Parameter. Test Conditions/Comments. Min. Typ. Max. Unit

ADA4098-1 Preliminary Technical Data B Grade H-Grade Parameter Test Conditions/Comments Min Typ Max Unit

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ADA4098-1 Preliminary Technical Data B Grade H-Grade Parameter Test Conditions/Comments Min Typ Max Min Typ Max Unit
INPUT CHARACTERISTICS Input Resistance Differential mode 1 1 1 MΩ Common mode >1 >1 >1 GΩ Over-The-Top Differential mode, VCM > 5 V 7 7 kΩ Common mode, VCM > 5 V >250 >250 MΩ Input Capacitance Differential mode 1 1 pF Common mode 3 3 pF SHDN PIN Input Logic Low Amplifier active, SHDN pin voltage −VS + 0.5 −VS + 0.5 V (VSHDN) < −VS + 0.5 V, TMIN < TA < TMAX Input Logic High Amplifier shutdown, VSHDN > −VS + 1.5 −VS + 1.5 V −VS + 1.5 V, TMIN < TA < TMAX Response Time Amplifier active to shutdown 2.5 2.5 μs Amplifier shutdown to active 30 30 μs Pull-Down Current VSHDN = −VS + 0.5 V, TMIN < TA < TMAX 0.6 3 0.6 3 µA VSHDN = −VS + 1.5 V, TMIN < TA < TMAX 0.3 2.5 0.3 2.5 µA OUTPUT CHARACTERISTICS Output Voltage Swing Low Overdrive voltage (V 4 OD ) = 30 mV, no 18 40 18 40 mV load TMIN < TA < TMAX 45 50 mV VOD = 30 mV, sink current, (ISINK) = 250 360 250 360 mV 10 mA TMIN < TA < TMAX 435 450 mV Output Voltage Swing High VOD = 30 mV, no load 2.5 10 2.5 10 mV TMIN < TA < TMAX 20 25 mV VOD = 30 mV, source current, 900 1100 900 1100 mV (ISOURCE) = 10 mA TMIN < TA < TMAX 1500 1650 mV Short-Circuit Current ISOURCE 24 40 24 40 mA TMIN< TA < TMAX 15 12 mA ISINK 35 50 35 50 mA TMIN < TA < TMAX 25 20 mA Output Pin Leakage During VSHDN = −VS + 1.5 V ±5 ±100 ±5 ±100 nA Shutdown TMIN < TA < TMAX ±10 ±10 µA POWER SUPPLY Maximum Operating Voltage5 50 50 V Operating Range Guaranteed by power supply 3 50 3 50 V rejection ratio (PSRR) Supply Current Amplifier active 162.5 175 162.5 175 mA TMIN < TA < TMAX 242 250 mA Amplifier shutdown VSHDN = −VS + 10 20 10 20 µA 1.5 V TMIN < TA < TMAX 22.5 22.5 µA PSRR VSY = 3 V to ±25 V 123 145 123 145 dB TMIN < TA < TMAX 122 120 dB THERMAL SHUTDOWN6 Temperature Junction temperature (TJ) 175 175 °C Hysteresis 20 20 °C Operating Temperature Ambient temperature (TA) −40 +125 −55 +150 °C 1 Thermoelectric voltages present in the high speed production test limit the measurement accuracy of this parameter. The limits shown in Table 1 are determined by test capability and are not necessarily indicative of actual device performance. 2 Offset voltage drift is guaranteed through lab characterization and is not production tested. 3 Test accuracy is limited by high speed production test equipment repeatability. Bench measurements indicate that the input offset current in Over-The-Top configuration is typically controlled to under 50 nA at +25°C and 100 nA over the −55°C < TA < +150°C temperature range. 4 VOD is +30 mV for VOUT high and −30 mV for VOUT low. 5 Maximum operating voltage is limited by the time-dependent dielectric breakdown (TDDB) of on-chip capacitor oxides. The amplifier tolerates temporary transient overshoot up to the specified absolute maximum rating, but the dc supply voltage must be limited to the maximum operating voltage. 6 Thermal shutdown is lab characterized only and is not tested in production. Rev. PrA | Page 4 of 27 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION TYPICAL APPLICATION CIRCUIT TABLE OF CONTENTS SPECIFICATIONS 5 V SUPPLY ±15 V SUPPLY ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INPUT PROTECTION OVER-THE-TOP OPERATION CONSIDERATIONS OUTPUT SHUTDOWN PIN (SHDN) APPLICATIONS INFORMATION LARGE RESISTOR GAIN OPERATION RECOMMENDED VALUES FOR VARIOUS GAINS NOISE DISTORTION POWER DISSIPATION AND THERMAL SHUTDOWN CIRCUIT LAYOUT CONSIDERATIONS POWER SUPPLY BYPASSING GROUNDING ESD PROTECTION WHEN POWERED RELATED PRODUCTS TYPICAL APPLICATIONS OUTLINE DIMENSIONS