link to page 6 link to page 6 AD823AData SheetABSOLUTE MAXIMUM RATINGS Table 4.THERMAL RESISTANCEParameter Rating θJA is specified for the worst-case conditions, that is, a device Supply Voltage 36 V soldered in a circuit board for surface-mount packages. Power Dissipation See Figure 4 The specification is for the device in free air. Input Voltage (Common Mode) ±VS ± 0.7 V Differential Input Voltage ±VS Table 5. Thermal Resistance Output Short-Circuit Duration See Figure 4 Package TypeθJA Unit Storage Temperature Range −65°C to +125°C 8-Lead SOIC_N 120 °C/W Operating Temperature Range −40°C to +85°C 8-Lead MSOP 133 °C/W Lead Temperature (Soldering, 10 sec) 300°C ESD Ratings (Human Body Model) 4500 V 2.0TJ = 150°C ESD Ratings (Charged Device Model) 1250 V )(W N IO 1.5T Stresses above those listed under Absolute Maximum Ratings PA8-LEAD SOIC may cause permanent damage to the device. This is a stress ISSI rating only; functional operation of the device at these or any D 1.0ER other conditions above those indicated in the operational W8-LEAD MSOP section of this specification is not implied. Exposure to absolute PO M maximum rating conditions for extended periods may affect MU 0.5XI device reliability. MA Use the part with caution at the 30 V supply as excessive output 0 current may overheat and damage the part. 4 –45 –35 –25 –15–551525354555657585 -00 9 AMBIENT TEMPERATURE (°C) 43 09 Figure 4. Maximum Power Dissipation vs. Temperature ESD CAUTION Rev. B | Page 6 of 20 Document Outline Features Applications General Description Connection Diagram Revision History Specifications 5 V Operation 3.3 V Operation ±15 V Operation Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Output Impedance Applications Information Input Characteristics Output Characteristics Wideband Photodiode Preamp Active Filter Maximizing Performance Through Proper Layout Outline Dimensions Ordering Guide