Datasheet HMC499 (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 21 - 32 GHz |
| Pages / Page | 6 / 4 — HMC499. GaAs PHEMT MMIC MEDIUM. POWER AMPLIFIER, 21 - 32 GHz. Absolute … |
| File Format / Size | PDF / 351 Kb |
| Document Language | English |
HMC499. GaAs PHEMT MMIC MEDIUM. POWER AMPLIFIER, 21 - 32 GHz. Absolute Maximum Ratings. Typical Supply Current vs. Vdd
Model Line for this Datasheet
Text Version of Document
HMC499
v03.0908
GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 21 - 32 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd1, Vdd2, Vdd3) +5.5 Vdc Vdd (Vdc) Idd (mA) Gate Bias Voltage (Vgg) -4 to 0 Vdc +4.5 193 RF Input Power (RFIN)(Vdd = +5Vdc) +20 dBm +5.0 200 +5.5 207 Channel Temperature 175 °C +3.0 191 3 Continuous Pdiss (T= 85 °C) 1.50 W (derate 16.7 mW/°C above 85 °C) +3.5 200 Thermal Resistance +4.0 208 60 °C/W (channel to die bottom) Note: Amplifi er will operate over full voltage ranges shown above. IP Storage Temperature -65 to +150 °C Vgg adjusted to achieve Idd= 200 mA at +5V and +3.5V. H Operating Temperature -55 to +85 °C ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS S - C R IE
Outline Drawing
IF L P M R A E W O R & P A E IN L
Die Packaging Information
[1] NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM] Standard Alternate 2. DIE THICKNESS IS .004” GP-2 (Gel Pack) [2] 3. TYPICAL BOND IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD [1] Refer to the “Packaging Information” section for die 5. BOND PAD METALLIZATION: GOLD packaging dimensions. 6. BACKSIDE METAL IS GROUND. [2] For alternate packaging information contact Hittite 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. Microwave Corporation. Information furnish F e o d r pri by An ce, de alog Devic leis vie s rby eli, a eve nd to pla d to be accur ce o ate an r d der relia s ble , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone rights of third parties that may result from its use. Specifications subject to change without notice. No : 978 Phon -e25 : 7 0 81 - - 3 3 3 29 4 - 3 F 470 ax 0 • O : 978 rder o - nl 25 in 0 e a - t 33 ww 73 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. w.analog.com
3 - 59
Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptipte.co licatio m n Support: Phone: 1-800-ANALOG-D
v03.0908
GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 21 - 32 GHz Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd1, Vdd2, Vdd3) +5.5 Vdc Vdd (Vdc) Idd (mA) Gate Bias Voltage (Vgg) -4 to 0 Vdc +4.5 193 RF Input Power (RFIN)(Vdd = +5Vdc) +20 dBm +5.0 200 +5.5 207 Channel Temperature 175 °C +3.0 191 3 Continuous Pdiss (T= 85 °C) 1.50 W (derate 16.7 mW/°C above 85 °C) +3.5 200 Thermal Resistance +4.0 208 60 °C/W (channel to die bottom) Note: Amplifi er will operate over full voltage ranges shown above. IP Storage Temperature -65 to +150 °C Vgg adjusted to achieve Idd= 200 mA at +5V and +3.5V. H Operating Temperature -55 to +85 °C ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS S - C R IE
Outline Drawing
IF L P M R A E W O R & P A E IN L
Die Packaging Information
[1] NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM] Standard Alternate 2. DIE THICKNESS IS .004” GP-2 (Gel Pack) [2] 3. TYPICAL BOND IS .004” SQUARE 4. BACKSIDE METALLIZATION: GOLD [1] Refer to the “Packaging Information” section for die 5. BOND PAD METALLIZATION: GOLD packaging dimensions. 6. BACKSIDE METAL IS GROUND. [2] For alternate packaging information contact Hittite 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. Microwave Corporation. Information furnish F e o d r pri by An ce, de alog Devic leis vie s rby eli, a eve nd to pla d to be accur ce o ate an r d der relia s ble , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone rights of third parties that may result from its use. Specifications subject to change without notice. No : 978 Phon -e25 : 7 0 81 - - 3 3 3 29 4 - 3 F 470 ax 0 • O : 978 rder o - nl 25 in 0 e a - t 33 ww 73 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. w.analog.com
3 - 59
Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptipte.co licatio m n Support: Phone: 1-800-ANALOG-D
