Datasheet HMC442LM1 (Analog Devices) - 8
| Manufacturer | Analog Devices |
| Description | GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 17.5 - 24.0 GHz |
| Pages / Page | 8 / 8 — HMC442LM1. GaAs PHEMT MMIC MEDIUM. POWER AMPLIFIER, 17.5 - 24.0 GHz. … |
| File Format / Size | PDF / 417 Kb |
| Document Language | English |
HMC442LM1. GaAs PHEMT MMIC MEDIUM. POWER AMPLIFIER, 17.5 - 24.0 GHz. Recommended SMT Attachment Technique
Model Line for this Datasheet
Text Version of Document
HMC442LM1
v01.0807
GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 17.5 - 24.0 GHz Recommended SMT Attachment Technique Preparation & Handling of the LM1 Microwave Package for Surface Mounting
The HMC LM1 package was designed to be compatible with high volume 225 surface mount PCB assembly processes. The LM1 package requires a 200 specifi c mounting pattern to allow proper mechanical attachment and to optimize electrical performance at millimeterwave frequencies. This PCB 175 C)0 layout pattern can be found on each LM1 product data sheet. It can also 150 be provided as an electronic drawing upon request from Hittite Sales & 125 Application Engineering. 100 11
Follow these precautions to avoid permanent damage:
TEMPERATURE ( 75 Cleanliness: Observe proper handling procedures to ensure clean devices 50 and PCBs. LM1 devices should remain in their original packaging until 25 T component placement to ensure no contamination or damage to RF, DC & 0 1 2 3 4 5 6 7 8 ground contact areas. TIME (min) Static Sensitivity: Follow ESD precautions to protect against ESD strikes. - SM General Handling: Handle the LM1 package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers. S Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure to the top of the lid. R Solder Materials & Temperature Profi le: Follow the information contained in the application note. Hand soldering is not recommended. Conductive epoxy attachment is not recommended. IE Solder Paste: Solder paste should be selected based on the user’s experience and be compatible with the metallization systems IF used. See the LM1 data sheet Outline drawing for pin & ground contact metallization schemes. L Solder Paste Application: Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of P solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical M performance. Excess solder may create unwanted electrical parasitics at high frequencies. Solder Refl ow: The soldering process is usually accomplished in a refl ow oven but may also use a vapor phase process. A solder refl ow profi le is suggested above. R A E Prior to refl owing product, temperature profi les should be measured using the same mass as the actual assemblies. The thermocouple should be moved to various positions on the board to account for edge and corner effects and varying component masses. The fi nal W profi le should be determined by mounting the thermocouple to the PCB at the location of the device. O Follow solder paste and oven vendor’s recommendations when developing a solder refl ow profi le. A standard profi le will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. Allow enough time between reaching pre-heat temperature and refl ow for the solvent in the paste to evaporate and the fl ux to completely activate. & P Refl ow must then occur prior to the fl ux being completely driven off. The duration of peak refl ow temperature should not exceed 15 seconds. Packages have been qualifi ed to withstand a peak temperature of 235°C for 15 seconds. Verify that the profi le will not R expose device to temperatures in excess of 235°C. A Cleaning: A water-based fl ux wash may be used. E IN L Information furnish F e o d r pri by An ce, de alog Devic leis vie s rby eli, a eve nd to pla d to be accur ce o ate an r d der relia s ble , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone rights of third parties that may result from its use. Specifications subject to change without notice. No : 978 Pho - n 25 e: 7 0- 81 3 3 3 2 4 9- 3 F 470 ax: 978 0 • Order o - n 25 lin 0 e a-t 3373 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
11 - 113
Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptipte.co licatio m n Support: Phone: 1-800-ANALOG-D
v01.0807
GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 17.5 - 24.0 GHz Recommended SMT Attachment Technique Preparation & Handling of the LM1 Microwave Package for Surface Mounting
The HMC LM1 package was designed to be compatible with high volume 225 surface mount PCB assembly processes. The LM1 package requires a 200 specifi c mounting pattern to allow proper mechanical attachment and to optimize electrical performance at millimeterwave frequencies. This PCB 175 C)0 layout pattern can be found on each LM1 product data sheet. It can also 150 be provided as an electronic drawing upon request from Hittite Sales & 125 Application Engineering. 100 11
Follow these precautions to avoid permanent damage:
TEMPERATURE ( 75 Cleanliness: Observe proper handling procedures to ensure clean devices 50 and PCBs. LM1 devices should remain in their original packaging until 25 T component placement to ensure no contamination or damage to RF, DC & 0 1 2 3 4 5 6 7 8 ground contact areas. TIME (min) Static Sensitivity: Follow ESD precautions to protect against ESD strikes. - SM General Handling: Handle the LM1 package on the top with a vacuum collet or along the edges with a sharp pair of bent tweezers. S Avoiding damaging the RF, DC, & ground contacts on the package bottom. Do not apply excess pressure to the top of the lid. R Solder Materials & Temperature Profi le: Follow the information contained in the application note. Hand soldering is not recommended. Conductive epoxy attachment is not recommended. IE Solder Paste: Solder paste should be selected based on the user’s experience and be compatible with the metallization systems IF used. See the LM1 data sheet Outline drawing for pin & ground contact metallization schemes. L Solder Paste Application: Solder paste is generally applied to the PCB using either a stencil printer or dot placement. The volume of P solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical M performance. Excess solder may create unwanted electrical parasitics at high frequencies. Solder Refl ow: The soldering process is usually accomplished in a refl ow oven but may also use a vapor phase process. A solder refl ow profi le is suggested above. R A E Prior to refl owing product, temperature profi les should be measured using the same mass as the actual assemblies. The thermocouple should be moved to various positions on the board to account for edge and corner effects and varying component masses. The fi nal W profi le should be determined by mounting the thermocouple to the PCB at the location of the device. O Follow solder paste and oven vendor’s recommendations when developing a solder refl ow profi le. A standard profi le will have a steady ramp up from room temperature to the pre-heat temperature to avoid damage due to thermal shock. Allow enough time between reaching pre-heat temperature and refl ow for the solvent in the paste to evaporate and the fl ux to completely activate. & P Refl ow must then occur prior to the fl ux being completely driven off. The duration of peak refl ow temperature should not exceed 15 seconds. Packages have been qualifi ed to withstand a peak temperature of 235°C for 15 seconds. Verify that the profi le will not R expose device to temperatures in excess of 235°C. A Cleaning: A water-based fl ux wash may be used. E IN L Information furnish F e o d r pri by An ce, de alog Devic leis vie s rby eli, a eve nd to pla d to be accur ce o ate an r d der relia s ble , pl . Ho ease co wever, no For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other ntact Hittite Microwave Corporation: One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 20 Alpha Road, Chelmsford, MA 01824 Phone rights of third parties that may result from its use. Specifications subject to change without notice. No : 978 Pho - n 25 e: 7 0- 81 3 3 3 2 4 9- 3 F 470 ax: 978 0 • Order o - n 25 lin 0 e a-t 3373 license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
11 - 113
Order On- Trademarks and registered trademarks are the property of their respective owners. line at www.hi A tptipte.co licatio m n Support: Phone: 1-800-ANALOG-D
