Datasheet ADL8111 (Analog Devices) - 7
| Manufacturer | Analog Devices |
| Description | 10 MHz to 8000 MHz Bypass Amplifier |
| Pages / Page | 24 / 7 — Data Sheet. ADL8111. TYPICAL PERFORMANCE CHARACTERISTICS. EXTERNAL BYPASS … |
| File Format / Size | PDF / 811 Kb |
| Document Language | English |
Data Sheet. ADL8111. TYPICAL PERFORMANCE CHARACTERISTICS. EXTERNAL BYPASS A STATE. RFIN TO OUT_A INPUT RETURN LOSS. URN L
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Data Sheet ADL8111 TYPICAL PERFORMANCE CHARACTERISTICS EXTERNAL BYPASS A STATE 0 B) 0 B) d –1 d ( ( S –2 S –2 S S –3 O O –4 –4 –5 RFIN TO OUT_A INPUT RETURN LOSS URN L –6 RFIN TO OUT_A INSERTION LOSS URN L T –6 RFIN TO OUT_A OUTPUT RETURN LOSS T –7 –8 –8 –9 +85°C –10 +25°C N AND RE –10 N AND RE –11 –40°C IO IO –12 RT –12 RT E –13 E NS –14 NS –14 –15 –16 –16 –17 ADBAND I –18 ADBAND I –18 –19 BRO –20 BRO –20 0 1 2 3 4 5 6 7 8 9 10
010
0 1 2 3 4 5 6 7 8
013
FREQUENCY (GHz)
20106-
FREQUENCY (GHz)
20106- Figure 10. Broadband Insertion and Return Loss vs. Frequency, Figure 13. Broadband Insertion and Return Loss vs. Frequency, State = External Bypass A, Path = RFIN to OUT_A (Refer to Figure 75 for the State = External Bypass A, Path = IN_A to RFOUT (Refer to Figure 75 for the Test Circuit) Test Circuit)
0 0 –1 –1 –2 –2 ) ) –3 –3 dB dB ( ( S –4 S –4 LOS –5 LOS –5 TION +85°C +85°C –6 TION R +25°C –6 R +25°C E E S –40°C S –40°C –7 IN –7 IN –8 –8 –9 –9 –10
1
–10
1
0 1 2 3 4 5 6 7 8
0
0 1 2 3 4 5 6 7 8
014
FREQUENCY (GHz)
20106-
FREQUENCY (GHz)
20106- Figure 11. Insertion Loss Over Temperature vs. Frequency, Figure 14. Insertion Loss Over Temperature vs. Frequency, State = External Bypass A, Path = RFIN to OUT_A (Refer to Figure 75 for the State = External Bypass A, Path = IN_A to RFOUT (Refer to Figure 75 for the Test Circuit) Test Circuit)
0 0 +85°C +85°C –5 +25°C –5 +25°C –40°C –40°C B) B) d d ( ( S S S S O –10 O –10 URN L URN L T T –15 –15 RE RE UT UT INP INP –20 –20 –25 –25 0 1 2 3 4 5 6 7 8
012
0 1 2 3 4 5 6 7 8
015
FREQUENCY (GHz)
20106-
FREQUENCY (GHz)
20106- Figure 12. Input Return Loss Over Temperature vs. Frequency, Figure 15. Input Return Loss Over Temperature vs. Frequency, State = External Bypass A, Path = RFIN to OUT_A (Refer to Figure 75 for the State = External Bypass A, Path = IN_A to RFOUT (Refer to Figure 75 for the Test Circuit) Test Circuit) Rev. 0 | Page 7 of 24 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE POWER DERATING CURVES ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS EXTERNAL BYPASS A STATE INTERNAL AMPLIFIER STATE INTERNAL BYPASS STATE EXTERNAL BYPASS B STATE TEST CIRCUITS THEORY OF OPERATION SIGNAL PATH STATES FOR DIGITAL CONTROL INPUTS APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING During Power-Up During Power-Down EVALUATION PCB EVALUATION BOARD SCHEMATIC OUTLINE DIMENSIONS ORDERING GUIDE
Data Sheet ADL8111 TYPICAL PERFORMANCE CHARACTERISTICS EXTERNAL BYPASS A STATE 0 B) 0 B) d –1 d ( ( S –2 S –2 S S –3 O O –4 –4 –5 RFIN TO OUT_A INPUT RETURN LOSS URN L –6 RFIN TO OUT_A INSERTION LOSS URN L T –6 RFIN TO OUT_A OUTPUT RETURN LOSS T –7 –8 –8 –9 +85°C –10 +25°C N AND RE –10 N AND RE –11 –40°C IO IO –12 RT –12 RT E –13 E NS –14 NS –14 –15 –16 –16 –17 ADBAND I –18 ADBAND I –18 –19 BRO –20 BRO –20 0 1 2 3 4 5 6 7 8 9 10
010
0 1 2 3 4 5 6 7 8
013
FREQUENCY (GHz)
20106-
FREQUENCY (GHz)
20106- Figure 10. Broadband Insertion and Return Loss vs. Frequency, Figure 13. Broadband Insertion and Return Loss vs. Frequency, State = External Bypass A, Path = RFIN to OUT_A (Refer to Figure 75 for the State = External Bypass A, Path = IN_A to RFOUT (Refer to Figure 75 for the Test Circuit) Test Circuit)
0 0 –1 –1 –2 –2 ) ) –3 –3 dB dB ( ( S –4 S –4 LOS –5 LOS –5 TION +85°C +85°C –6 TION R +25°C –6 R +25°C E E S –40°C S –40°C –7 IN –7 IN –8 –8 –9 –9 –10
1
–10
1
0 1 2 3 4 5 6 7 8
0
0 1 2 3 4 5 6 7 8
014
FREQUENCY (GHz)
20106-
FREQUENCY (GHz)
20106- Figure 11. Insertion Loss Over Temperature vs. Frequency, Figure 14. Insertion Loss Over Temperature vs. Frequency, State = External Bypass A, Path = RFIN to OUT_A (Refer to Figure 75 for the State = External Bypass A, Path = IN_A to RFOUT (Refer to Figure 75 for the Test Circuit) Test Circuit)
0 0 +85°C +85°C –5 +25°C –5 +25°C –40°C –40°C B) B) d d ( ( S S S S O –10 O –10 URN L URN L T T –15 –15 RE RE UT UT INP INP –20 –20 –25 –25 0 1 2 3 4 5 6 7 8
012
0 1 2 3 4 5 6 7 8
015
FREQUENCY (GHz)
20106-
FREQUENCY (GHz)
20106- Figure 12. Input Return Loss Over Temperature vs. Frequency, Figure 15. Input Return Loss Over Temperature vs. Frequency, State = External Bypass A, Path = RFIN to OUT_A (Refer to Figure 75 for the State = External Bypass A, Path = IN_A to RFOUT (Refer to Figure 75 for the Test Circuit) Test Circuit) Rev. 0 | Page 7 of 24 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE POWER DERATING CURVES ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS EXTERNAL BYPASS A STATE INTERNAL AMPLIFIER STATE INTERNAL BYPASS STATE EXTERNAL BYPASS B STATE TEST CIRCUITS THEORY OF OPERATION SIGNAL PATH STATES FOR DIGITAL CONTROL INPUTS APPLICATIONS INFORMATION RECOMMENDED BIAS SEQUENCING During Power-Up During Power-Down EVALUATION PCB EVALUATION BOARD SCHEMATIC OUTLINE DIMENSIONS ORDERING GUIDE
