Datasheet HMC8411LP2FE (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | Low Noise Amplifier, 0.01 GHz to 10 GHz |
| Pages / Page | 23 / 5 — Data Sheet. HMC8411LP2FE. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. … |
| Revision | B |
| File Format / Size | PDF / 554 Kb |
| Document Language | English |
Data Sheet. HMC8411LP2FE. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 4. Parameter1. Rating. Table 5. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
link to page 6 link to page 6 link to page 23
Data Sheet HMC8411LP2FE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 4. Parameter1 Rating
Thermal performance is directly linked to printed circuit board Drain Bias Voltage (V (PCB) design and operating environment. Close attention to DD) 7 V Radio Frequency Input (RF PCB thermal design is required. IN) Power 20 dBm Channel Temperature 175°C θJC is the junction to case thermal resistance. Continuous Power Dissipation (PDISS), T = 85°C 1.098 W (Derate 12.2 mW/°C Above 85°C)
Table 5. Thermal Resistance
Storage Temperature Range −65°C to +150°C
Package Type θJC Unit
Operating Temperature Range −40°C to +85°C CP-6-12 82 °C/W Peak Reflow Temperature Moisture 260°C Sensitivity Level 1 (MSL1)2 Electrostatic Discharge (ESD) Sensitivity
ESD CAUTION
Human Body Model (HBM) 500 V, Class 1B passed 1 When referring to a single function of a multifunction pin in the parameters, only the portion of the pin name that is relevant to the specification is listed. For full pin names of multifunction pins, refer to the Pin Configuration and Function Descriptions section. 2 See the Ordering Guide section for more information. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 5 of 23 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications 0.01 GHz to 1 GHz Frequency Range 1 GHz to 6 GHz Frequency Range 6 GHz to 10 GHz Frequency Range Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Recommended Bias Sequencing During Power-Up During Power-Down Typical Application Circuit Evaluation Board Outline Dimensions Ordering Guide
Data Sheet HMC8411LP2FE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE Table 4. Parameter1 Rating
Thermal performance is directly linked to printed circuit board Drain Bias Voltage (V (PCB) design and operating environment. Close attention to DD) 7 V Radio Frequency Input (RF PCB thermal design is required. IN) Power 20 dBm Channel Temperature 175°C θJC is the junction to case thermal resistance. Continuous Power Dissipation (PDISS), T = 85°C 1.098 W (Derate 12.2 mW/°C Above 85°C)
Table 5. Thermal Resistance
Storage Temperature Range −65°C to +150°C
Package Type θJC Unit
Operating Temperature Range −40°C to +85°C CP-6-12 82 °C/W Peak Reflow Temperature Moisture 260°C Sensitivity Level 1 (MSL1)2 Electrostatic Discharge (ESD) Sensitivity
ESD CAUTION
Human Body Model (HBM) 500 V, Class 1B passed 1 When referring to a single function of a multifunction pin in the parameters, only the portion of the pin name that is relevant to the specification is listed. For full pin names of multifunction pins, refer to the Pin Configuration and Function Descriptions section. 2 See the Ordering Guide section for more information. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 5 of 23 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications 0.01 GHz to 1 GHz Frequency Range 1 GHz to 6 GHz Frequency Range 6 GHz to 10 GHz Frequency Range Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Theory of Operation Applications Information Recommended Bias Sequencing During Power-Up During Power-Down Typical Application Circuit Evaluation Board Outline Dimensions Ordering Guide
