Data Sheet. HMC8400. 0.40. 4GHz. 0.38. 10GHz. 16GHz. 22GHz. 28GHz. 0.36. N IO T. Bc). 0.34. D3 (. ISSI. 0.32. D ER W. 0.30. 0.28. 0.26. POUT/TONE (dBm)
Data SheetHMC8400600.404GHz0.384GHz10GHz10GHz16GHz16GHz50)22GHz22GHz28GHz0.36(W28GHzN IO TBc)0.34dPA40D3 (ISSI0.32IMD ER W0.3030PO0.28200.26012345678 018 –6–4–202468 021 POUT/TONE (dBm)INPUT POWER (dBm) 13852- 13852- Figure 20. IMD3 vs. POUT/Tone for Various Frequencies at VDD = 5 V Figure 23. Power Dissipation vs. Input Power at Various Frequencies, TA = 85°C 60204GHz 10GHz1016GHz5022GHz 28GHz0Bc)B)dd40–10N (D3 (AIIMG–20–2.0V30–1.6V0V–1.4V+0.4V–30–1.2V+1.0V–1.0V+1.6V–0.8V+2.2V–0.4V+2.6V20–40012345678 019 051015202530 032 POUT/TONE (dBm)FREQUENCY (GHz) 13852- 13852- Figure 21. IMD3 vs. POUT/Tone for Various Frequencies at VDD = 6 V Figure 24. Gain vs. Frequency at Various VGG2 Voltage Levels 00–10+85°C–5+25°C –55°C–10–20)B) ddB(–15(–30S S OTION–20–40OLAURN L T–25ISRE–50–2.0V–30–1.6V0V–1.4V+0.4V–60–1.2V+1.0V–35–1.0V+1.6V–0.8V+2.2V–0.4V+2.6V–70–40051015202530 020 051015202530 033 FREQUENCY (GHz)FREQUENCY (GHz) 13852- 13852- Figure 22. Reverse Isolation vs. Frequency at Various Temperatures Figure 25. Input Return Loss vs. Frequency at Various VGG2 Voltage Levels Rev. B | Page 9 of 15 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS 2 GHz TO 6 GHz FREQUENCY RANGE 6 GHz TO 20 GHz FREQUENCY RANGE 20 GHz TO 30 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION BIASING PROCEDURES MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICs Handling Precautions Mounting Eutectic Die Attach Epoxy Die Attach Wire Bonding TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE