Datasheet HMC382LP3, 382LP3E (Analog Devices) - 5

HMC382LP3 / 382LP3E
v02.0320
GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 1.7 - 2.2 GHz 16-Lead Lead Frame Chip Scale Package [LFCSP] 3 x 3 mm Body and 0.90 mm Package Height (CP-16-54) Outline Drawing Dimensions shown in millimeters DETAIL A
T
(JEDEC 95) 3.10 0.28
M
3.00 SQ 0.23 PIN 1 2.90 0.18
S
INDICATOR PIN 1 (C 0.30 x 0.30) INDICATOR AREA OPTIONS
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0.50 13 16 (SEE DETAIL A) 12 1 BSC
E
1.70 EXPOSED
IS
1.60 SQ PAD 1.50
O
9 4 0.50 8 5
N
0.20 MIN TOP VIEW BOTTOM VIEW 0.40 0.30
W
1.00 0.90 0.05 MAX
LO
0.80 0.02 NOM COPLANARITY
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SEATING 0.08 PLANE 0.20 REF
S R
PKG-005129 COMPLIANT WITH JEDEC STANDARDS MO-220-VEED-6. 05-16-2017-A
IE 16-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm and 0.90 mm Package Height LIF (CP-16-54) P Dimensions shown in mil imeters M A
Package Information
Part Number Package Body Material Lead Finish MSL Rating [1] Package Marking [2] 382 HMC382LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3 XXXX 382 HMC382LP3ETR RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL3 XXXX [1] Max peak reflow temperature of 260 °C [2] 4-Digit lot number XXXX For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
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Application Support: Phone: 1-800-ANALOG-D