Datasheet HMC356LP3, 356LP3E (Analog Devices) - 4
| Manufacturer | Analog Devices |
| Description | GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 350 - 550 MHz |
| Pages / Page | 6 / 4 — HMC356LP3 / 356LP3E. GaAs PHEMT MMIC LOW NOISE. AMPLIFIER, 350 - 550 MHz. … |
| File Format / Size | PDF / 406 Kb |
| Document Language | English |
HMC356LP3 / 356LP3E. GaAs PHEMT MMIC LOW NOISE. AMPLIFIER, 350 - 550 MHz. Absolute Maximum Ratings
Model Line for this Datasheet
Text Version of Document
HMC356LP3 / 356LP3E
v03.0610
GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 350 - 550 MHz
7
Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +8.0 Vdc Vdd (Vdc) Idd (mA) RF Input Power (RFIN)(Vdd = +5.0 Vdc) +15 dBm +4.5 103 T Channel Temperature 150 °C +5.0 104 Continuous Pdiss (T = 85 °C) +5.5 105 0.910 W (derate 14 mW/°C above 85 °C) Thermal Resistance 71.4 °C/W E - SM (channel to ground paddle) Storage Temperature -65 to +150 °C ELECTROSTATIC SENSITIVE DEVICE IS Operating Temperature -40 to +85 °C OBSERVE HANDLING PRECAUTIONS W NO O
Outline Drawing
- L S R IE IF L P M A NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] 356 HMC356LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] 356 HMC356LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX Info F rmoatr pr ion f iurcne, de ished b ly iv A e n r al y o a g D n evd to p ices is bla eli c eve o ed t rde o be ras: H ccuratite tiatne M d reli iacr ble ow . Ho av wev e C er, n o o rpo Fora r t p iro ic n e ,, 2 d 0 eli A ve lrpha R y, and toad, C o place hoel rd m er s s fo : Ard, MA 01 nalog Devic 8 e 2 s 4 , Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rde hone r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .ehit r o t nilte in .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
7 - 49
Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r app tion Su s p @ po h rt itt : P ite ho .c ne o : 1m -800-ANALOG-D
v03.0610
GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 350 - 550 MHz
7
Absolute Maximum Ratings Typical Supply Current vs. Vdd
Drain Bias Voltage (Vdd) +8.0 Vdc Vdd (Vdc) Idd (mA) RF Input Power (RFIN)(Vdd = +5.0 Vdc) +15 dBm +4.5 103 T Channel Temperature 150 °C +5.0 104 Continuous Pdiss (T = 85 °C) +5.5 105 0.910 W (derate 14 mW/°C above 85 °C) Thermal Resistance 71.4 °C/W E - SM (channel to ground paddle) Storage Temperature -65 to +150 °C ELECTROSTATIC SENSITIVE DEVICE IS Operating Temperature -40 to +85 °C OBSERVE HANDLING PRECAUTIONS W NO O
Outline Drawing
- L S R IE IF L P M A NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE 4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM. PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM. 5. PACKAGE WARP SHALL NOT EXCEED 0.05mm. 6. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO PCB RF GROUND. 7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3] [1] 356 HMC356LP3 Low Stress Injection Molded Plastic Sn/Pb Solder MSL1 XXXX [2] 356 HMC356LP3E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1 XXXX [1] Max peak refl ow temperature of 235 °C [2] Max peak refl ow temperature of 260 °C [3] 4-Digit lot number XXXX Info F rmoatr pr ion f iurcne, de ished b ly iv A e n r al y o a g D n evd to p ices is bla eli c eve o ed t rde o be ras: H ccuratite tiatne M d reli iacr ble ow . Ho av wev e C er, n o o rpo Fora r t p iro ic n e ,, 2 d 0 eli A ve lrpha R y, and toad, C o place hoel rd m er s s fo : Ard, MA 01 nalog Devic 8 e 2 s 4 , Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rde hone r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .ehit r o t nilte in .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
7 - 49
Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r app tion Su s p @ po h rt itt : P ite ho .c ne o : 1m -800-ANALOG-D
