Datasheet ADPA7002CHIP (Analog Devices)

ManufacturerAnalog Devices
DescriptionGaAs, pHEMT, MMIC,1/2 W, 20 GHz to 44 GHz, Power Amplifier
Pages / Page23 / 1 — GaAs, pHEMT, MMIC,1/2 W,. 20 GHz to 44 GHz, Power Amplifier. Data Sheet. …
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GaAs, pHEMT, MMIC,1/2 W,. 20 GHz to 44 GHz, Power Amplifier. Data Sheet. ADPA7002CHIP. FEATURES. FUNCTIONAL BLOCK DIAGRAM

Datasheet ADPA7002CHIP Analog Devices, Revision: C

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GaAs, pHEMT, MMIC,1/2 W, 20 GHz to 44 GHz, Power Amplifier Data Sheet ADPA7002CHIP FEATURES FUNCTIONAL BLOCK DIAGRAM Output P1dB: 28 dBm (typical at 34 GHz to 44 GHz) P V SAT: 30 dBm (typical at 20 GHz to 34 GHz) REF VGG1A VDD1A VDD2A VDD3A Gain: 15 dB (typical at 34 GHz to 44 GHz) IP3: 40 dBm (typical) ADPA7002CHIP Supply voltage: 5 V at 600 mA RFIN RFOUT Die size: 2.75 mm × 1.805 mm × 0.1 mm APPLICATIONS GND Military and space V Test instrumentation V V GG1B DD1B VDD2B DD3B V
001
DET
17236- Figure 1.
GENERAL DESCRIPTION
The ADPA7002CHIP is a gallium arsenide (GaAs), monolithic a 5 V supply on VDD1B, VDD2B, and VDD3B. The ADPA7002CHIP microwave integrated circuit (MMIC), pseudomorphic high also features inputs/outputs (I/Os) that are internally matched to electron mobility transistor (pHEMT), distributed power 50 Ω, and facilitates integration into multichip modules (MCMs). amplifier that operates from 20 GHz to 44 GHz. The amplifier Al data is taken with the on substrate chip connected via two provides 15 dB of small signal gain, 28 dBm output power at wire bonds that are 0.025 mm (1 mil) wide and 0.31 mm (12 mils) 1 dB gain compression (P1dB), and a typical output third-order long. intercept (IP3) of 40 dBm. The amplifier requires 600 mA from
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Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 20 GHz TO 34 GHz FREQUENCY RANGE 34 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS CONSTANT DRAIN CURRENT (IDD) OPERATION THEORY OF OPERATION ADPA7002CHIP ASSEMBLY AND CIRCUIT DIAGRAMS ALTERNATE ASSEMBLY DIAGRAM BIASING PROCEDURES BIASING THE ADPA7002CHIP WITH THE HMC980LP4E Application Circuit Setup Limiting VGATE to Meet ADPA7002CHIP VGGx AMR Requirement HMC980LP4E Bias Sequence Constant Drain Current Bias vs. Constant Gate Voltage Bias MOUNTING AND BONDING TECHNIQUES FOR MILLIMETER WAVE GAAS MMICS Handling Precautions Mounting Wire Bonding OUTLINE DIMENSIONS ORDERING GUIDE