Data SheetADMV7710TYPICAL PERFORMANCE CHARACTERISTICS30025TA = +85°C20–5TA = +25°CINPUT RETURN LOSSTA = –55°C15GAINB)OUTPUT RETURN LOSSd ()10–10SBS5OSE (d N0–15URN L T–5ESPORER–10–20UT–15INP–20–25–25–30–3069707172737475767778 009 71.071.572.072.573.073.574.074.575.075.576.0 012 FREQUENCY (GHz) 16408- FREQUENCY (GHz) 16408- Figure 9. Broadband Gain and Return Loss Response vs. Frequency, IDD = 800 mA Figure 12. Input Return Loss vs. Frequency over Various Temperatures, IDD = 800 mA 30028–2TA = +85°CTA = +25°C26T–4A = –55°CB) d24(–6S S22O–8B) d20N (URN L–10AITG18RE–12TA = +85°CUT16TPA = +25°C–14TA = –55°CUT14O–1612–1810–2071.071.572.072.573.073.574.074.575.075.576.0 010 71.071.572.072.573.073.574.074.575.075.576.0 013 FREQUENCY (GHz) 16408- FREQUENCY (GHz) 16408- Figure 10. Gain vs. Frequency over Various Temperatures, IDD = 800 mA Figure 13. Output Return Loss vs. Frequency over Various Temperatures, IDD = 800 mA 30–3028TA = +85°C–35TA = +25°C26TA = –55°C)–40B24(d N–4522IOB)TdA L20N (–50AISOG18SE I–55500mA16600mA 700mAEVER R–6014800mA 900mA–651210 1 –70 1 71.071.572.072.573.073.574.074.575.075.576.0 0 71.071.572.072.573.073.574.074.575.075.576.0 014 FREQUENCY (GHz) 16408- FREQUENCY (GHz) 16408- Figure 11. Gain vs. Frequency over IDD Figure 14. Reverse Isolation vs. Frequency over Various Temperatures, IDD = 800 mA Rev. A | Page 7 of 18 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION APPLICATIONS INFORMATION ASSEMBLY DIAGRAM MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GaAs MMICS HANDLING PRECAUTIONS Storage Cleanliness Static Sensitivity Transients General Handling MOUNTING Eutectic Die Attach Epoxy Die Attach WIRE BONDING OUTLINE DIMENSIONS ORDERING GUIDE