Datasheet HMC863ALC4 (Analog Devices) - 8
| Manufacturer | Analog Devices |
| Description | GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 24 - 29.5 GHz |
| Pages / Page | 11 / 8 — HMC863ALC4. GaAs pHEMT MMIC 1/2 WATT. POWER AMPLIFIER, 24 - 29.5 GHz. … |
| File Format / Size | PDF / 930 Kb |
| Document Language | English |
HMC863ALC4. GaAs pHEMT MMIC 1/2 WATT. POWER AMPLIFIER, 24 - 29.5 GHz. Absolute Maximum Ratings. Reliability Information
Model Line for this Datasheet
Text Version of Document
HMC863ALC4
v02.0118
GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 24 - 29.5 GHz Absolute Maximum Ratings Reliability Information
Nominal Drain Supply to GND +6.3 V Junction Temperature to Main- 175 °C tain 1 Million Hour MTTF Gate Bias Voltage (Vgg1) -3.0 to 0 Vdc Nominal Junction Temperature Continuous Pdiss (T= 85 °C) 145.06 °C 2.88 W (T=85 °C, Vdd = +5.5 V) (derate 31.54 mW/°C above 85 °C) Thermal Resistance RF Input Power +26 dBm 31.2 °C/W (channel to ground paddle) Output Load VSWR 7:1
Stresses at or above those listed under Absolute Maxi-
Storage Temperature -65 to 150 °C
mum Ratings may cause permanent damage to the prod-
Operating Temperature -40 to +85 °C
uct. This is a stress rating only, functional operation of the product at these or any other conditions above those indi-
Max Peak Reflow Temperature 260 °C 9
cated in the operational section of this specification is not
ESD Sensitivity (HBM) Class 1A - Passed 350V
implied. Operation beyond the maximum operating condi- tions for extended periods may affect product reliability.
T M ELECTROSTATIC SENSITIVE DEVICE
24-Terminal Ceramic Leadless Chip Carrier [LCC] (E-24-1)
OBSERVE HANDLING PRECAUTIONS
Dimensions shown in millimeters.
R - S
Outline Drawing
E
4.05 0.36
W
3.90 SQ 0.30 PIN 1 3.75 0.08 0.24
O
INDICATOR BSC PIN 1 19 24 18 1 0.50 BSC 2.60 EXPOSED PAD 2.50 SQ
R & P
2.40
A
13 6 12 7
E
TOP VIEW 0.32 BOTTOM VIEW BSC 2.50 REF
IN
1.00 3.10 BSC 0.90 SIDE VIEW 0.80 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND SEATING FUNCTION DESCRIPTIONS
S - L
PLANE SECTION OF THIS DATA SHEET.
R IE
PKG-004840 02-27-2017-B
24-Terminal Ceramic Leadless Chip Carrier [LCC] LIF (E-24-1) P Dimensions shown in mil imeters. M A
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking HMC863ALC4 Alumina, White Gold over Nickel MSL3 [1] H863A XXXX [1] Max peak reflow temperature of 260 °C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
9 - 8
Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Gain & Return Loss Absolute Maximum Ratings Outline Drawing Package Information Pin Descriptions Evaluation PCB List of Materials Application Circuit
v02.0118
GaAs pHEMT MMIC 1/2 WATT POWER AMPLIFIER, 24 - 29.5 GHz Absolute Maximum Ratings Reliability Information
Nominal Drain Supply to GND +6.3 V Junction Temperature to Main- 175 °C tain 1 Million Hour MTTF Gate Bias Voltage (Vgg1) -3.0 to 0 Vdc Nominal Junction Temperature Continuous Pdiss (T= 85 °C) 145.06 °C 2.88 W (T=85 °C, Vdd = +5.5 V) (derate 31.54 mW/°C above 85 °C) Thermal Resistance RF Input Power +26 dBm 31.2 °C/W (channel to ground paddle) Output Load VSWR 7:1
Stresses at or above those listed under Absolute Maxi-
Storage Temperature -65 to 150 °C
mum Ratings may cause permanent damage to the prod-
Operating Temperature -40 to +85 °C
uct. This is a stress rating only, functional operation of the product at these or any other conditions above those indi-
Max Peak Reflow Temperature 260 °C 9
cated in the operational section of this specification is not
ESD Sensitivity (HBM) Class 1A - Passed 350V
implied. Operation beyond the maximum operating condi- tions for extended periods may affect product reliability.
T M ELECTROSTATIC SENSITIVE DEVICE
24-Terminal Ceramic Leadless Chip Carrier [LCC] (E-24-1)
OBSERVE HANDLING PRECAUTIONS
Dimensions shown in millimeters.
R - S
Outline Drawing
E
4.05 0.36
W
3.90 SQ 0.30 PIN 1 3.75 0.08 0.24
O
INDICATOR BSC PIN 1 19 24 18 1 0.50 BSC 2.60 EXPOSED PAD 2.50 SQ
R & P
2.40
A
13 6 12 7
E
TOP VIEW 0.32 BOTTOM VIEW BSC 2.50 REF
IN
1.00 3.10 BSC 0.90 SIDE VIEW 0.80 FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND SEATING FUNCTION DESCRIPTIONS
S - L
PLANE SECTION OF THIS DATA SHEET.
R IE
PKG-004840 02-27-2017-B
24-Terminal Ceramic Leadless Chip Carrier [LCC] LIF (E-24-1) P Dimensions shown in mil imeters. M A
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking HMC863ALC4 Alumina, White Gold over Nickel MSL3 [1] H863A XXXX [1] Max peak reflow temperature of 260 °C For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com Application Support: Phone: 1-800-ANALOG-D
9 - 8
Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Gain & Return Loss Absolute Maximum Ratings Outline Drawing Package Information Pin Descriptions Evaluation PCB List of Materials Application Circuit
