Datasheet HMC1087F10 (Analog Devices) - 9
| Manufacturer | Analog Devices |
| Description | 8 WATT Flange Mount GaN MMIC POWER AMPLIFIER, 2 - 20 GHz |
| Pages / Page | 12 / 9 — HMC1087F10. 8 WATT Flange Mount GaN MMIC. POWER AMPLIFIER, 2 - 20 GHz. … |
| File Format / Size | PDF / 733 Kb |
| Document Language | English |
HMC1087F10. 8 WATT Flange Mount GaN MMIC. POWER AMPLIFIER, 2 - 20 GHz. Pin Descriptions
Model Line for this Datasheet
Text Version of Document
HMC1087F10
v04.1217
8 WATT Flange Mount GaN MMIC POWER AMPLIFIER, 2 - 20 GHz Pin Descriptions
pin number function Description interface schematic T m RFIN s 1 Vgg Gate Control Voltage. VGG r - e These pins are not connected internally, however all data 2, 4, 5, 7, nC shown was measured with these pins connected to rf/ w 9, 10 DC ground externally. o p RFIN This pad is DC coupled and is matched to 50 ohms. 3 rfin external blocking capacitor is required. r & VGG A e 6 Vdd Drain bias. lin s - r This pad is DC coupled and is matched to 50 ohms. 8 rfoUT ie external blocking capacitor is required. lif p The package base must be mounted to a suitable heat package m GnD sink for rf & DC ground. recommended mounting Base screws are #0-80 socket cap screws. A For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
9
Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Low Frequency Gain & Return Loss Noise Figure vs. Frequency P1dB vs. Temperature Psat vs. Temperature P1dB vs. Vdd Psat vs. Vdd Output IP3 vs. Temperature @ Pout = 18 dBm Tone Power Compression @ 10 GHz Power Dissipation Second Harmonics vs. Temperature @ Pout = 18 dBm Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Pout Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit
v04.1217
8 WATT Flange Mount GaN MMIC POWER AMPLIFIER, 2 - 20 GHz Pin Descriptions
pin number function Description interface schematic T m RFIN s 1 Vgg Gate Control Voltage. VGG r - e These pins are not connected internally, however all data 2, 4, 5, 7, nC shown was measured with these pins connected to rf/ w 9, 10 DC ground externally. o p RFIN This pad is DC coupled and is matched to 50 ohms. 3 rfin external blocking capacitor is required. r & VGG A e 6 Vdd Drain bias. lin s - r This pad is DC coupled and is matched to 50 ohms. 8 rfoUT ie external blocking capacitor is required. lif p The package base must be mounted to a suitable heat package m GnD sink for rf & DC ground. recommended mounting Base screws are #0-80 socket cap screws. A For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 781-329-4700 • Order online at www.analog.com
9
Application Support: Phone: 1-800-ANALOG-D Document Outline Typical Applications Features Functional Diagram General Description Electrical Specifications Performance Characteristics Gain & Return Loss Gain vs. Temperature Input Return Loss vs. Temperature Output Return Loss vs. Temperature Low Frequency Gain & Return Loss Noise Figure vs. Frequency P1dB vs. Temperature Psat vs. Temperature P1dB vs. Vdd Psat vs. Vdd Output IP3 vs. Temperature @ Pout = 18 dBm Tone Power Compression @ 10 GHz Power Dissipation Second Harmonics vs. Temperature @ Pout = 18 dBm Second Harmonics vs. Vdd @ Pout = 18 dBm Second Harmonics vs. Pout Absolute Maximum Ratings Typical Supply Current vs. Vdd Outline Drawing Die Packaging Information Pad Descriptions Assembly Diagram Application Circuit
