link to page 15 link to page 15 ADL6010Data Sheet1410CALIBRATION AT –25dBm, –10dBm, AND +8dBm03–121B) d –2N (1E (V)AIB)G A–3dD GLTR (E00.1OIZ –4RROT VALEU–1TPRM –5–55°C –40°COUNO–2+25°C0.01–6+85°C +125°C–7–3 008 –8 11617- –40.001 1 1 0.1110100–30–25–20–15–10–505101520 0 FREQUENCY (MHz)PIN (dBm) 1617- 1 Figure 10. Envelope Bandwidth of VOUT vs. Frequency at PIN = −10 dBm and Figure 13. Conformance Error and Output Voltage (VOUT) vs. Modulation Depth = 10% (See Figure 39 in the Measurement Setups Section) RF Input Power (PIN) for Various Temperatures at 5 GHz 410410CALIBRATION AT –26dBm, –14dBm, AND +5dBmCALIBRATION AT –28dBm, –10dBm, AND +10dBm332121E (V)1GE (V)B)1GdAB)ALTdR (OLT00.1R (00.1OT VRROUT VERROU–1TPE –1–55°CTPOU–55°C–40°C–40°COU–2+25°C0.01–2+25°C0.01+85°C+85°C+125°C+125°C–3–3–40.001–40.001–30–25–20–15–10–505101520 012 –30–25–20–15–10–505101520 015 PIN (dBm) 1617- 1 PIN (dBm) 1617- 1 Figure 11. Distribution of Conformance Error with Respect to Output Voltage Figure 14. Conformance Error and Output Voltage (VOUT) vs. (VOUT) at 25°C vs. RF Input Power (PIN) for Various Temperatures at 0.5 GHz RF Input Power (PIN) for Various Temperatures at 10 GHz 410410CALIBRATION AT –25dBm, –10dBm, AND +8dBmCALIBRATION AT –25dBm, –10dBm, AND +8dBm332121E (V)1E (V)1GB)GB)AdAdLTLTR (R (O00.1O00.1T VRROT VRROUEUE–1–1TPTP–55°C–55°COU–40°COU–40°C–2+25°C0.01–2+25°C0.01+85°C+85°C+125°C+125°C–3–3–40.001–40.001 013 –30–25–20–15–10–505101520 010 –30–25–20–15–10–505101520PP 1617- IN (dBm) 1617- 1 IN (dBm) 1 Figure 12. Conformance Error and Output Voltage (VOUT) vs. Figure 15. Distribution of Conformance Error with Respect to Output Voltage RF Input Power (PIN) for Various Temperatures at 1 GHz (VOUT) at 25°C vs. RF Input Power (PIN) for Various Temperatures at 1 GHz Rev. E | Page 10 of 23 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS MEASUREMENT SETUPS THEORY OF OPERATION BASIC CONNECTIONS PCB LAYOUT RECOMMENDATIONS SYSTEM CALIBRATION AND ERROR CALCULATION EFFECT OF A CAPACITIVE LOAD ON RISE TIME AND FALL TIME EVALUATION BOARD EVALUATION BOARD ASSEMBLY DRAWINGS OUTLINE DIMENSIONS ORDERING GUIDE