Datasheet AMP03 (Analog Devices) - 3

AMP03 WAFER TEST LIMITS (@ VS =
ⴞ
15 V, TA = 25
ⴗ
C, unless otherwise noted.)* AMP03GBC Parameter Symbol Conditions Limit Unit
Offset Voltage VOS VS = ± 18 V 0.5 mV max Gain Error No Load, VIN = ± 10 V, RS = 0 Ω 0.008 % max Input Voltage Range IVR ±10 V min Common-Mode Rejection CMR VCM = ± 10 V 80 dB min Power Supply Rejection Ratio PSRR VS = ± 6 V to ± 18 V 8 µV/V max Output Swing VO RL = 2 kΩ ±12 V max Short-Circuit Current Limit ISC Output Shorted to Ground +45/–15 mA min Supply Current ISY No Load 3.5 mA max *Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
ABSOLUTE MAXIMUM RATINGS1 DICE CHARACTERISTICS
Supply Voltage . ± 18 V Input Voltage2 . Supply Voltage Output Short-Circuit Duration . Continuous Storage Temperature Range
1. REFERENCE
P, J Package . –65°C to +150°C
2. –IN
Lead Temperature (Soldering, 60 sec) . 300°C
3. +IN 4. –VEE
Junction Temperature . 150°C
5. SENSE
Operating Temperature Range
6. OUTPUT 7. +VCC
AMP03B . –55°C to +125°C
8. NC
AMP03F, AMP03G . –40°C to +85°C
Package Type
␪
3
␪
JA JC Unit
Header (J) 150 18 °C/W
DIE SIZE 0.076 inch
ⴛ
0.076 inch, 5,776 sq. mm
8-Lead PDIP (P) 103 43 °C/W
(1.93 mm
ⴛ
1.93 mm, 3.73 sq. mm)
8-Lead SOIC (S) 155 40 °C/W
BURN-IN CIRCUIT
NOTES 1Absolute maximum ratings apply to both DICE and packaged parts, unless
+18V
otherwise noted. 2For supply voltages less than ± 18 V, the absolute maximum input voltage is equal to the supply voltage.
AMP03 25k
⍀ 3θJA is specified for worst-case mounting conditions, i.e., θJA is specified for device in socket for header and PDIP packages and for device soldered to printed circuit board for SOIC package.
25k
⍀
25k
⍀
ORDERING GUIDE Temperature Package Package Model1 Range Description Option2 –18V
AMP03GP –40°C to +85°C 8-Lead PDIP P-8
SLEW RATE TEST CIRCUIT
AMP03BJ –40°C to +85°C Header H-08B AMP03FJ –40°C to +85°C Header H-08B
+15V 0.1
␮
F
AMP03BJ/883C –55°C to +125°C Header H-08B AMP03GS –40°C to +85°C 8-Lead SOIC S-8 AMP03GS-REEL –40°C to +85°C 8-Lead SOIC S-8
AMP03
5962-9563901MGA –55°C to +125°C Header H-08B AMP03GBC Die
VOUT =
ⴞ
10V
NOTES 1
V
Burn-in is available on commercial and industrial temperature range parts in
IN =
ⴞ
10V
PDIP and header packages.
0.1
␮
F
2Consult factory for /883 data sheet.
–15V CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the AMP03 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
ESD SENSITIVE DEVICE
precautions are recommended to avoid performance degradation or loss of functionality. REV. F –3– Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PIN CONNECTIONS SPECIFICATIONS WAFER TEST LIMITS ABSOLUTE MAXIMUM RATINGS ORDERING GUIDE DICE CHARACTERISTICS BURN-IN CIRCUIT SLEW RATE TEST CIRCUIT Typical Performance Characteristics APPLICATION CIRCUITS APPLICATIONS INFORMATION MAINTAINING COMMON-MODE REJECTION OUTLINE DIMENSIONS Revision History