Datasheet ADG1608, ADG1609 (Analog Devices) - 9
| Manufacturer | Analog Devices |
| Description | 4.5 Ω RON, 8-Channel ±5 V,+12 V, +5 V, and +3.3 V Multiplexer |
| Pages / Page | 20 / 9 — Data Sheet. ADG1608/ADG1609. PIN CONFIGURATIONS AND FUNCTION … |
| Revision | A |
| File Format / Size | PDF / 480 Kb |
| Document Language | English |
Data Sheet. ADG1608/ADG1609. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. PIN 1. INDICATOR. 12 GND. S1 2. 11 VDD. ADG1608. S2 3. 10 S5
Model Line for this Datasheet
Text Version of Document
Data Sheet ADG1608/ADG1609 PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS EN A0 A1 A2 16 15 14 13 PIN 1 V 1 INDICATOR SS 12 GND S1 2 11 VDD ADG1608 S2 3 10 S5 TOP VIEW A0 1 16 A1 S3 4 (Not to Scale) 9 S6 EN 2 15 A2 V 3 SS 14 GND 5 6 7 8 S1 4 ADG1608 13 V D DD S4 S8 S7 TOP VIEW S2 5 12 S5 (Not to Scale) NOTES 1. THE EXPOSED PAD IS CONNECTED S3 6 11 S6 INTERNALLY. FOR INCREASED RELIABILITY OF THE SOLDER S4 7 10 S7 JOINTS AND MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED D 8 9 S8
003 004
THAT THE PAD BE SOLDERED TO THE SUBSTRATE, VSS.
08318- 08318- Figure 3. ADG1608 Pin Configuration (TSSOP) Figure 4. ADG1608 Pin Configuration (LFCSP)
Table 8. ADG1608 P in Function Descriptions Pin No. TSSOP LFCSP Mnemonic Description
1 15 A0 Logic Control Input. 2 16 EN Active High Digital Input. When this pin is low, the device is disabled and all switches are off. When this pin is high, Ax logic inputs determine on switches. 3 1 VSS Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground. 4 2 S1 Source Terminal 1. Can be an input or an output. 5 3 S2 Source Terminal 2. Can be an input or an output. 6 4 S3 Source Terminal 3. Can be an input or an output. 7 5 S4 Source Terminal 4. Can be an input or an output. 8 6 D Drain Terminal. Can be an input or an output. 9 7 S8 Source Terminal 8. Can be an input or an output. 10 8 S7 Source Terminal 7. Can be an input or an output. 11 9 S6 Source Terminal 6. Can be an input or an output. 12 10 S5 Source Terminal 5. Can be an input or an output. 13 11 VDD Most Positive Power Supply Potential. 14 12 GND Ground (0 V) Reference. 15 13 A2 Logic Control Input. 16 14 A1 Logic Control Input. N/A EP EP Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 9. ADG1608 Tr uth Table A2 A1 A0 EN On Switch
X1 X1 X1 0 None 0 0 0 1 1 0 0 1 1 2 0 1 0 1 3 0 1 1 1 4 1 0 0 1 5 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 1 X = don’t care. Rev. A | Page 9 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±5 V DUAL SUPPLY 12 V SINGLE SUPPLY 5 V SINGLE SUPPLY 3.3 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, S OR D ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY OUTLINE DIMENSIONS ORDERING GUIDE
003 004
THAT THE PAD BE SOLDERED TO THE SUBSTRATE, VSS.
08318- 08318- Figure 3. ADG1608 Pin Configuration (TSSOP) Figure 4. ADG1608 Pin Configuration (LFCSP)
Table 8. ADG1608 P in Function Descriptions Pin No. TSSOP LFCSP Mnemonic Description
1 15 A0 Logic Control Input. 2 16 EN Active High Digital Input. When this pin is low, the device is disabled and all switches are off. When this pin is high, Ax logic inputs determine on switches. 3 1 VSS Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground. 4 2 S1 Source Terminal 1. Can be an input or an output. 5 3 S2 Source Terminal 2. Can be an input or an output. 6 4 S3 Source Terminal 3. Can be an input or an output. 7 5 S4 Source Terminal 4. Can be an input or an output. 8 6 D Drain Terminal. Can be an input or an output. 9 7 S8 Source Terminal 8. Can be an input or an output. 10 8 S7 Source Terminal 7. Can be an input or an output. 11 9 S6 Source Terminal 6. Can be an input or an output. 12 10 S5 Source Terminal 5. Can be an input or an output. 13 11 VDD Most Positive Power Supply Potential. 14 12 GND Ground (0 V) Reference. 15 13 A2 Logic Control Input. 16 14 A1 Logic Control Input. N/A EP EP Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 9. ADG1608 Tr uth Table A2 A1 A0 EN On Switch
X1 X1 X1 0 None 0 0 0 1 1 0 0 1 1 2 0 1 0 1 3 0 1 1 1 4 1 0 0 1 5 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 1 X = don’t care. Rev. A | Page 9 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±5 V DUAL SUPPLY 12 V SINGLE SUPPLY 5 V SINGLE SUPPLY 3.3 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, S OR D ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY OUTLINE DIMENSIONS ORDERING GUIDE
