Datasheet ADG1608, ADG1609 (Analog Devices) - 10
| Manufacturer | Analog Devices |
| Description | 4.5 Ω RON, 8-Channel ±5 V,+12 V, +5 V, and +3.3 V Multiplexer |
| Pages / Page | 20 / 10 — ADG1608/ADG1609. Data Sheet. PIN 1. INDICATOR. 12 VDD. S1A 2. 11 S1B. … |
| Revision | A |
| File Format / Size | PDF / 480 Kb |
| Document Language | English |
ADG1608/ADG1609. Data Sheet. PIN 1. INDICATOR. 12 VDD. S1A 2. 11 S1B. ADG1609. S2A 3. 10 S2B. TOP VIEW. S3A 4. (Not to Scale). S3B. GND. VDD. S1A 4. S1B
Model Line for this Datasheet
Text Version of Document
ADG1608/ADG1609 Data Sheet ND EN A0 A1 G 16 15 14 13 PIN 1 V 1 INDICATOR SS 12 VDD S1A 2 11 S1B ADG1609 S2A 3 10 S2B TOP VIEW A0 1 16 A1 S3A 4 (Not to Scale) 9 S3B EN 2 15 GND V 3 SS 14 VDD 5 6 7 8 S1A 4 ADG1609 13 S1B A A D SB 4B TOP VIEW S4 S S2A 5 12 S2B (Not to Scale) NOTES 1. THE EXPOSED PAD IS CONNECTED S3A 6 11 S3B INTERNALLY. FOR INCREASED RELIABILITY OF THE SOLDER S4A 7 10 S4B JOINTS AND MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED DA 8 9 DB
006 005
THAT THE PAD BE SOLDERED TO THE SUBSTRATE, VSS.
08318- 08318- Figure 5. ADG1609 Pin Configuration (TSSOP) Figure 6. ADG1609 Pin Configuration (LFCSP)
Table 10. ADG1609 P in Function Descriptions Pin No. TSSOP LFCSP Mnemonic Description
1 15 A0 Logic Control Input. 2 16 EN Active High Digital Input. When this pin is low, the device is disabled and all switches are off. When this pin is high, Ax logic inputs determine on switches. 3 1 VSS Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground. 4 2 S1A Source Terminal 1A. Can be an input or an output. 5 3 S2A Source Terminal 2A. Can be an input or an output. 6 4 S3A Source Terminal 3A. Can be an input or an output. 7 5 S4A Source Terminal 4A. Can be an input or an output. 8 6 DA Drain Terminal A. Can be an input or an output. 9 7 DB Drain Terminal B. Can be an input or an output. 10 8 S4B Source Terminal 4B. Can be an input or an output. 11 9 S3B Source Terminal 3B. Can be an input or an output. 12 10 S2B Source Terminal 2B. Can be an input or an output. 13 11 S1B Source Terminal 1B. Can be an input or an output. 14 12 VDD Most Positive Power Supply Potential. 15 13 GND Ground (0 V) Reference. 16 14 A1 Logic Control Input. N/A EP EP Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 11. ADG1609 Tr uth Table A1 A0 EN On Switch Pair
X1 X1 0 None 0 0 1 1 0 1 1 2 1 0 1 3 1 1 1 4 1 X = don’t care. Rev. A | Page 10 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±5 V DUAL SUPPLY 12 V SINGLE SUPPLY 5 V SINGLE SUPPLY 3.3 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, S OR D ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY OUTLINE DIMENSIONS ORDERING GUIDE
006 005
THAT THE PAD BE SOLDERED TO THE SUBSTRATE, VSS.
08318- 08318- Figure 5. ADG1609 Pin Configuration (TSSOP) Figure 6. ADG1609 Pin Configuration (LFCSP)
Table 10. ADG1609 P in Function Descriptions Pin No. TSSOP LFCSP Mnemonic Description
1 15 A0 Logic Control Input. 2 16 EN Active High Digital Input. When this pin is low, the device is disabled and all switches are off. When this pin is high, Ax logic inputs determine on switches. 3 1 VSS Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground. 4 2 S1A Source Terminal 1A. Can be an input or an output. 5 3 S2A Source Terminal 2A. Can be an input or an output. 6 4 S3A Source Terminal 3A. Can be an input or an output. 7 5 S4A Source Terminal 4A. Can be an input or an output. 8 6 DA Drain Terminal A. Can be an input or an output. 9 7 DB Drain Terminal B. Can be an input or an output. 10 8 S4B Source Terminal 4B. Can be an input or an output. 11 9 S3B Source Terminal 3B. Can be an input or an output. 12 10 S2B Source Terminal 2B. Can be an input or an output. 13 11 S1B Source Terminal 1B. Can be an input or an output. 14 12 VDD Most Positive Power Supply Potential. 15 13 GND Ground (0 V) Reference. 16 14 A1 Logic Control Input. N/A EP EP Exposed Pad. The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 11. ADG1609 Tr uth Table A1 A0 EN On Switch Pair
X1 X1 0 None 0 0 1 1 0 1 1 2 1 0 1 3 1 1 1 4 1 X = don’t care. Rev. A | Page 10 of 20 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAMS GENERAL DESCRIPTION PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ±5 V DUAL SUPPLY 12 V SINGLE SUPPLY 5 V SINGLE SUPPLY 3.3 V SINGLE SUPPLY CONTINUOUS CURRENT PER CHANNEL, S OR D ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY OUTLINE DIMENSIONS ORDERING GUIDE
