link to page 3 link to page 3 link to page 6 Data SheetADG1433/ADG1434ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. THERMAL RESISTANCETable 4. θJA is specified for the worst-case conditions, that is, a device ParameterRating soldered in a circuit board for surface-mount packages. VDD to VSS 35 V Table 5. VDD to GND −0.3 V to +25 V Package TypeθJAθJCUnit VSS to GND −25 V to +0.3 V TSSOP 150.4 50 °C/W Analog Inputs1 VSS − 0.3 V to VDD + 0.3 V or LFCSP 30.4 N/A1 °C/W 30 mA (whichever occurs first) Digital Inputs1 GND − 0.3 V to VDD + 0.3 V or 1 N/A means not applicable. 30 mA (whichever occurs first) ESD CAUTION Peak Current, S or D (Pulsed at 1 ms, 250 mA 10% Duty Cycle Maximum) Continuous Current, S or D2 Data + 15% Operating Temperature Range Industrial (Y Version) −40°C to +125°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C Reflow Soldering Peak 260 (+ 0 to −5)°C Temperature (Pb-Free) 1 Overvoltages at A, EN, S, or D pins are clamped by internal diodes. Current must be limited to the maximum ratings given. 2 See data given in the Specifications section (see Table 1 to Table 3). Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Only one absolute maximum rating may be applied at any one time. Rev. E | Page 7 of 20 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAMS REVISION HISTORY SPECIFICATIONS ±15 V DUAL SUPPLY 12 V SINGLE SUPPLY ±5 V DUAL SUPPLY ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TEST CIRCUITS TERMINOLOGY OUTLINE DIMENSIONS ORDERING GUIDE