ADG511/ADG512/ADG5130.006 network RC and CC. This compensation network also reduces VDD = +5V the hold time glitch while optimizing the acquisition time. Using VSS = –5V the illustrated op amps and component values, the pedestal 0.004ITD (ON)A = +25C error has a maximum value of 5 mV over the ± 3 V input range. nA The acquisition time is 2.5 µs while the settling time is 1.85 µs. –0.002ID (OFF)+5V0.000IS (OFF)2200pF+5V–0.002SW2+5VSDCLEAKAGE CURRENTCRC1000pFOP07VOUTVINSW1–0.00475AD845SDCH2200pF–5V–0.006–5V–5–4–3–2–1012345ADG511/VD OR VS – DRAIN OR SOURCE VOLTAGE – VADG512/ ADG513 TPC 7. Leakage Currents as a Function of VD (VS) –5V Figure 1. Accurate Sample-and-Hold 110VDD = +5V VSS = –5VTRENCH ISOLATION100 The MOS devices that make up the ADG511A/ADG512A/ ADG513A are isolated from each other by an oxide layer (trench) (see Figure 2). When the NMOS and PMOS devices dB –90 are not electrically isolated from each other, there exists the possibility of “latch-up” caused by parasitic junctions between 80 CMOS transistors. Latch-up is caused when P-N junctions that CROSSTALK are normally reverse biased, become forward biased, causing large currents to flow. This can be destructive. 70 CMOS devices are normally isolated from each other by Junction Isolation. In Junction Isolation the N and P wells of the CMOS 60 transistors form a diode that is reverse biased under normal 1001k10k100k1M10MFREQUENCY – Hz operation. However, during overvoltage conditions, this diode becomes forward biased. A Silicon-Controlled Rectifier (SCR)- TPC 8. Crosstalk vs. Frequency type circuit is formed by the two transistors, causing a signifi- cant amplification of the current that, in turn, leads to latch-up. APPLICATION With Trench Isolation, this diode is removed; the result is a Figure 1 illustrates a precise sample-and-hold circuit. An AD845 latch-up-proof circuit. is used as the input buffer while the output operational ampli- fier is an OP07. During the track mode, SW1 is closed and the VGVG output V VVVV OUT follows the input signal VIN. In the hold mode, SDSD SW1 is opened and the signal is held by the hold capacitor CH. Due to switch and capacitor leakage, the voltage on the hold TP-CHANNELTN-CHANNELTP+P+N+N+RRR capacitor will decrease with time. The ADG511/ADG512/ EEE ADG513 minimizes this droop due to its low leakage specifica- NNNCCC tions. The droop rate is further minimized by the use of a poly- HHP–N–H styrene hold capacitor. The droop rate for the circuit shown is BURIED OXIDE LAYER typically 15 µV/µs. SUBSTRATE (BACKGATE) A second switch, SW2, which operates in parallel with SW1, is included in this circuit to reduce pedestal error. Since both Figure 2. Trench Isolation switches will be at the same potential, they will have a differen- tial effect on the op amp OP07, which will minimize charge injection effects. Pedestal error is also reduced by the compensation –8– REV. C