Datasheet TCET1100, TCET1100G (Vishay) - 2

TCET1100, TCET1100G
www.vishay.com Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS
(Tamb = 25 °C, unless otherwise specified)
PARAMETER TEST CONDITION SYMBOL VALUE UNIT INPUT
Reverse voltage VR 6 V Forward current IF 60 mA Forward surge current tp ≤ 10 μs IFSM 1.5 A
OUTPUT
Collector emitter voltage VCEO 70 V Emitter collector voltage VECO 7 V Collector current IC 50 mA Collector peak current tp/T = 0.5, tp ≤ 10 ms ICM 100 mA
COUPLER
Isolation test voltage (RMS) t = 1 min VISO 5000 VRMS Operating ambient temperature range Tamb -40 to +100 °C Storage temperature range Tstg -55 to +125 °C Soldering temperature (1) 2 mm from case, ≤ 10 s Tsld 260 °C
Notes
• Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability (1) Refer to wave profile for soldering conditions for through hole devices
THERMAL CHARACTERISTICS PARAMETER SYMBOL VALUE UNIT
LED power dissipation Pdiss 100 mW TA Output power dissipation Pdiss 150 mW Maximum LED junction temperature Tjmax. 125 °C θCA Maximum output die junction temperature Tjmax. 125 °C Package TC θ Thermal resistance, junction emitter to board θ EC EB 173 °C/W θDC T θ T Thermal resistance, junction emitter to case θ JD DE JE EC 149 °C/W Thermal resistance, junction detector to board θDB 111 °C/W θDB Thermal resistance, junction detector to case θ θ DC 127 °C/W EB TB Thermal resistance, junction emitter to θ junction detector ED 173 °C/W θBA Thermal resistance, board to ambient (1) θBA 197 °C/W 19996 T Thermal resistance, case to ambient (1) θ A CA 4041 °C/W
Notes
• The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay’s “Thermal Characteristics of Optocouplers” application note (1) For 2 layer FR4 board (4" x 3" x 0.062") Rev. 2.4, 13-Jan-2021
2
Document Number: 83503 For technical questions, contact: optocoupleranswers@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000