Datasheet KMA210 (NXP) - 6

NXP Semiconductors KMA210 Programmable angle sensor
VO (%VDD) αrng V(CL)u V(CL)I 0 α α ref αmax (deg) 180 αsw(CL) αref + 180° 001aag811 max = ref + rng
Fig 3. Characteristic of the analog output 7. Diagnostic features
The KMA210 provides several diagnostic features:
7.1 CRC and EDC supervision
The KMA210 includes a supervision of the programmed data. At power-on, a CRC of the non-volatile memory is performed. Furthermore the memory is protected against bit errors. Every 16-bit data word is saved internally as a 22-bit word for this purpose. The protection logic corrects any single-bit error in a data word, while the sensor continues in normal operation mode. Double-bit errors per word will be detected and switches the device into diagnostic mode.
7.2 Magnet-loss detection
If the applied magnetic field strength is not sufficient, the KMA210 can raise a diagnostic condition. In order to enter the diagnostic mode, due to magnet-loss, the detection has to be enabled first. The device can be programmed into active diagnostic mode, where the output is driven below 4 %VDD or above 96 %VDD.
7.3 Power-loss detection
The power-loss detection circuit enables the detection of an interrupted supply or ground line of the mixed signal IC in normal operation mode up to the maximum operating supply voltage. In the case of a power-loss condition, two internal switches in the sensor are closed, connecting the pin of the analog output to the supply voltage and the ground pins. KMA210 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 7 December 2011 6 of 37
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 2. Pinning information 3. Ordering information 4. Functional diagram 5. Functional description 5.1 Angular measurement directions 6. Analog output 7. Diagnostic features 7.1 CRC and EDC supervision 7.2 Magnet-loss detection 7.3 Power-loss detection 7.4 Broken bond wire detection 7.5 Low supply voltage detection and overvoltage protection 8. Limiting values 9. Recommended operating conditions 10. Thermal characteristics 11. Characteristics 12. Definition of errors 12.1 General 12.2 Hysteresis error 12.3 Linearity error 12.4 Microlinearity error 12.5 Temperature drift error 12.6 Angular error 13. Programming 13.1 General description 13.2 Timing characteristics 13.3 Sending and receiving data 13.3.1 Write access 13.3.2 Read access 13.3.3 Entering the command mode 13.4 Cyclic redundancy check 13.4.1 Software example in C 13.5 Registers 13.5.1 Command registers 13.5.2 Non-volatile memory registers 14. Electromagnetic compatibility 14.1 Emission (CISPR 25) 14.1.1 Conducted radio disturbance 14.1.2 Radiated radio disturbance 14.2 Radiated disturbances (ISO 11452-1 third edition (2005-02), ISO 11452-2, ISO 11452-4 and ISO 11452-5) 14.2.1 Absorber lined shielded enclosure 14.2.2 Bulk-current injection 14.2.3 Strip line 14.2.4 Immunity against mobile phones 14.3 Electrical transient transmission by capacitive coupling [ISO 7637-3, second edition (2007-07)] 15. ElectroStatic Discharge (ESD) 15.1 Human body model (AEC-Q100-002) 15.2 Human metal model (ANSI/ESD SP5.6-2009) 15.3 Machine model (AEC-Q100-003) 15.4 Charged-device model (AEC-Q100-011) 16. Application information 17. Test information 17.1 Quality information 18. Marking 19. Terminals 20. Package outline 21. Handling information 22. Solderability information 23. Revision history 24. Legal information 24.1 Data sheet status 24.2 Definitions 24.3 Disclaimers 24.4 Trademarks 25. Contact information 26. Contents