Datasheet ADG801, ADG802 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | <0.4 Ω CMOS 1.8 V to 5.5 V SPST Switches |
| Pages / Page | 16 / 5 — Data Sheet. ADG801/ADG802. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter … |
| File Format / Size | PDF / 299 Kb |
| Document Language | English |
Data Sheet. ADG801/ADG802. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter Rating. Table 4. Truth Table. ADG801 (Pin IN)
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Data Sheet ADG801/ADG802 ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Stresses above those listed under Absolute Maximum Ratings
Table 3.
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
Parameter Rating
other conditions above those indicated in the operational VDD to GND −0.3 V to +7 V section of this specification is not implied. Exposure to absolute Analog Inputs1 −0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first maximum rating conditions for extended periods may affect Digital Inputs1 −0.3 V to VDD + 0.3 V or device reliability. 30 mA, whichever occurs first
Table 4. Truth Table
Continuous Current, Pin S or Pin D 400 mA
ADG801 (Pin IN) ADG802 (Pin IN) Switch Condition
Peak Current, Pin S or Pin D 800 mA, pulsed at 1 ms, 10% duty cycle max 0 1 Off Operating Temperature Range −40°C to +125°C 1 0 On Automotive Storage Temperature Range −65°C to +150°C Junction Temperature (T
ESD CAUTION
JMAX) 150°C Package Power Dissipation (TJMAX – TA)/θJA MSOP θJA Thermal Impedance 206°C/W θJC Thermal Impedance 44°C/W SOT-23 (4-Layer Board) θJA Thermal Impedance 119°C/W θ JC Thermal Impedance 91.99°C/W Lead Temperature, Soldering 300°C (10 sec) IR Reflow, Peak Temperature 235°C (<20 sec) Reflow Soldering (Pb-Free) Peak Temperature 260(+0/−5)°C Time at Peak Temperature 10 sec to 40 sec 1 Overvoltages at Pin IN, Pin S, or Pin D are clamped by internal diodes. Current should be limited to the maximum ratings provided. Rev. B | Page 5 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
Data Sheet ADG801/ADG802 ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Stresses above those listed under Absolute Maximum Ratings
Table 3.
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
Parameter Rating
other conditions above those indicated in the operational VDD to GND −0.3 V to +7 V section of this specification is not implied. Exposure to absolute Analog Inputs1 −0.3 V to VDD + 0.3 V or 30 mA, whichever occurs first maximum rating conditions for extended periods may affect Digital Inputs1 −0.3 V to VDD + 0.3 V or device reliability. 30 mA, whichever occurs first
Table 4. Truth Table
Continuous Current, Pin S or Pin D 400 mA
ADG801 (Pin IN) ADG802 (Pin IN) Switch Condition
Peak Current, Pin S or Pin D 800 mA, pulsed at 1 ms, 10% duty cycle max 0 1 Off Operating Temperature Range −40°C to +125°C 1 0 On Automotive Storage Temperature Range −65°C to +150°C Junction Temperature (T
ESD CAUTION
JMAX) 150°C Package Power Dissipation (TJMAX – TA)/θJA MSOP θJA Thermal Impedance 206°C/W θJC Thermal Impedance 44°C/W SOT-23 (4-Layer Board) θJA Thermal Impedance 119°C/W θ JC Thermal Impedance 91.99°C/W Lead Temperature, Soldering 300°C (10 sec) IR Reflow, Peak Temperature 235°C (<20 sec) Reflow Soldering (Pb-Free) Peak Temperature 260(+0/−5)°C Time at Peak Temperature 10 sec to 40 sec 1 Overvoltages at Pin IN, Pin S, or Pin D are clamped by internal diodes. Current should be limited to the maximum ratings provided. Rev. B | Page 5 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS TERMINOLOGY TEST CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
