GRENOBLE, France - February 3, 2003 . . . Atmel® Corporation (Nasdaq: ATML) today announced the availability of two PowerPC microprocessor-based Multi-Chip Modules (MCM's) designed to fit in high performance, high-reliability, space sensitive applications. These products provide the user significant space savings in addition to increased performance.
The PC755M8 features a PowerPC 755B microprocessor along with 1 MByte of backside level-two (L2)-cache memory. The PC7410M16 features a PowerPC 7410 microprocessor, including the AltiVecTM, 128-bit wide, vector processing unit, along with 2 MByte of backside L2-cache memory.
Both products are available in both Industrial (-40 to +110 degree Celsius) and Military (-55 to +125 degree Celsius) temperature range. Standard package is a 255-ball Ceramic Ball Grid Array (CBGA) that significantly reduces the motherboard design complexity and eliminates high-speed memory signal wiring.
These products are the first result of a fruitful agreement between Atmel Corporation and White Electronic Designs Corporation (Nasdaq: WEDC) that allows the two companies to cooperatively design, manufacture and market PowerPC-based Multi-Chip Modules to the Extended Reliability, Aerospace and Military markets.
