Texas Instruments (TI) Delivers Breakthrough Pricing for High-Performance TMS320C64xTM DSPs

Texas Instruments TMS320C6410 TMS320C6413

Texas Instruments Incorporated (TI) announced two new high performance digital signal processors (DSP), the TMS320C6410 and TMS320C6413, available at breakthrough price points. Targeting packet-switched telecom including video over IP and other cost-sensitive, high performance applications, the new devices provide TMS320C64xTM performance with additional memory, peripheral and lower price options. Extending the C64xTM roadmap to include these new low-cost devices, a new performance value vector has been added to the roadmap, including the TMS320C6410 DSP, which provides more than 6X performance per dollar improvement over high-end C64x devices developed in 2002 and is priced at only $17.95. (For more information or to see the latest C6000 roadmap, please see: www.ti.com/performancevaluepr.)

Customers Require High-Performance and Low-Cost
The C6410 and C6413 DSPs extend the C64x generation and create a fundamental shift in the price/performance ratio for high-end DSPs. Customers have awaited this transformation, which will enable the next wave of innovation in DSP applications. The C6410, priced at $17.95, offers a substantial price/performance ratio of 89 MMACs (Million Multiply - Accumulates) per dollar, while the C6413, priced at $28.95, offers 69 MMACS per dollar at a clock rate of 500 MHz.

Integrated on-chip are two standard McBSPs for multi-channel clocked serial communication, two Audio Serial Ports compatible with IIS and common stereo codecs, a 16-/32-bit microprocessor Host Port Interface, and two IIC control serial ports. Also included is an on-chip oscillator that lowers overall system cost by enabling developers to use a lower cost crystal in place of an external oscillator.

Pricing and Availability
The TMS320C6410 running at 400 MHz with 160 Kbytes total memory is $17.95 (10Ku), and the 500 MHz TMS320C6413 has 288 Kbytes total memory and costs $28.95 (10Ku). Both are packaged in a 23 mm x 23 mm flip-chip BGA package (288 pins, 4 rows, 1.0 mm BGA pitch), which maximizes channel density and allows four layer board routing. Samples are available now with full production slated for September 2004.