News & Press Releases Fairchild - 2
Manufacturer: "Fairchild"
Search results: 43 Output: 11-20
- High-Voltage IGBTs Reduce Total Power Losses, Board Size and Overall System Costs in High-Power Solar Inverters, UPS, and Welders Fairchild Semiconductor introduces a series of 1200 V field stop trench IGBTs . Targeting hard-switching industrial ...16-12-2013
- Integrated Solution Features MOSFET and Diode in One Package, Simplifying Board Assembly and Saving Space Fairchild Semiconductor optimizes the MOSFET and diode selection process by introducing a family of 100 V BoostPak devices that combines a ...04-06-2013
- Optimized Mid-Voltage MOSFETs Provide Four Times Less Junction-to-Ambient Thermal Resistance Designers of DC-DC conversion applications are challenged with improving power density while saving board space and reducing thermal resistance. Fairchild ...17-01-2013
- Discretes Power Fairchild FGB7N60UNDF FGB5N60UNDF FGP10N60UNDF FGP15N60UNDF FGPF10N60UNDF FGPF15N60UNDF600V IGBTs Increase Power Density, Meet Stringent Energy Guidelines Fairchild Semiconductor has expanded its Short Circuit Rated IGBT product offering to provide motor drive designers higher efficiency, increased power density and improved ...26-09-2012
- Devices Offer Thin Package and Low Gate Current Leakage To help designers of cellular handsets and other portable applications improve battery charging and load switching, Fairchild Semiconductor has expanded its line of P-Channel PowerTrench ...11-08-2012
- FSL206MRx Series Eliminates Auxiliary Bias Winding, Simplifies Design Switch mode power supply (SMPS) designers need space-saving, cost- effective power supply solutions with high energy efficiency, optimized system performance and improved ...06-07-2012
- Device Minimizes Heat Sink Requirements, Lowers Operating Temperatures In order to meet demanding emissions and high fuel efficiency requirements in present and emerging ignition systems, automotive designers need higher performance ignition coil ...12-06-2012
- Device's Wide Body 5-Pin SOP Package Increases Creepage and Clearance Distance, Achieves a Compact Foot Print High power industrial applications such as solar inverters, uninterruptible power supplies (UPS) and motor drives demand a gate driver ...22-05-2012
- New Product for GSM/GPRS/EDGE, 3G/3.5G and 4G Power Amplifiers Provide Improved Heat Dissipation in a Small Form Factor Mobile device designers are faced with changing standards and a need to increase battery life, and extend talk and data transmit ...05-04-2012
- Device Reduces Design Cycle, Simplifies Design and Saves Board Space Designers are confronted with the challenge of two audio configuration jack standards the Open Mobile Terminal Platform (OMTP) L/R/M/G and Cellular Telephone Industries ...11-03-2012
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