News & Press Releases - Power - 8
Subsection: "Power"
Search results: 974 Output: 71-80
- Infineon Technologies is launching a new 1200 V IGBT generation TRENCHSTOP™ IGBT6. It is the first discrete IGBT duopack on the market manufactured on 12 inch wafer size. The new IGBT technology is designed to fulfill the increasing customer ...Aug 7, 2018
- 3-fold Half-Bridge Driver IC E523.50 for BLDC Applications Elmos introduces with the E523.50 , a threefold 72 V half-bridge driver for brushless DC (BLDC) motors. Feasible are automotive applications with 12/24 V- (Trucks) and 48 V board net power ...Aug 7, 2018
- New device offers significantly reduced footprint for automotive 3-phase brushless motor applications Toshiba Electronics Europe announces the availability of a new compact power MOSFET gate driver intelligent power device (IPD) for automotive ...Jul 26, 2018
- Feature-Rich ISL68300 and ISL68301 Deliver up to Eight Phases and More Than 240 A for FPGAs, DSPs, ASICs, and Network Processors Renesas Electronics announced two new PMBus™ compliant, fully digital DC/DC controllers that provide single ...Jul 24, 2018
- Analog Devices announces the Power by Linear™ LTM4678 dual 25 A or single 50 A step-down µModule® regulator with PMBus digital interface. By stacking and exposing its two inductors on top of BGA package, the LTM4678 uses the ...Jul 19, 2018
- Optimal power efficiency using the latest technology sets a new industry standard for high power density applications Alpha and Omega Semiconductor introduced the AONX38168 , which utilizes the latest 25 V N-Channel MOSFET Technology. The XSPairFET ...Jul 11, 2018
- FAN6500xx series delivers exceptional levels of integration for higher efficiency and reliability ON Semiconductor has announced the release of three new highly-efficient mid-voltage PWM buck converters. Supporting a wide input voltage range of 4.5 ...Jul 3, 2018
- Simple to use board simplifies and speeds up development process Toshiba Electronics Europe announces a new evaluation board for their TPD420xF series of brushless DC (BLDC) three-phase motor driver ICs to speed up the process of prototyping and ...Jun 18, 2018
- New packaging design provides 1.7 times higher rupture resistance than conventional press-pack packaging Toshiba Electronics Europe will be providing details on its new packaging for its 4.5 kV class press-pack IEGT (PPI) devices at PCIM 2018 in ...Jun 13, 2018
- Highly integrated, wide-Vin DC/DC buck regulators simplify the design of industrial power supplies Texas Instruments (TI) introduced two wide-V IN synchronous SIMPLE SWITCHER® DC/DC buck regulators in ultra-small HotRod™ quad flat no-lead ...Jun 12, 2018
