Datasheet AD8613, AD8617, AD8619 (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | Low Cost Micropower, Low Noise CMOS Rail-to-Rail, Input/Output Operational Amplifiers |
| Pages / Page | 16 / 5 — Data Sheet. AD8613/AD8617/AD8619. ABSOLUTE MAXIMUM RATINGS. THERMAL … |
| Revision | H |
| File Format / Size | PDF / 291 Kb |
| Document Language | English |
Data Sheet. AD8613/AD8617/AD8619. ABSOLUTE MAXIMUM RATINGS. THERMAL RESISTANCE. Table 3. Parameter Rating
Model Line for this Datasheet
Text Version of Document
Data Sheet AD8613/AD8617/AD8619 ABSOLUTE MAXIMUM RATINGS
T
THERMAL RESISTANCE
A = 25°C, unless otherwise noted. θJA is specified for the worst-case conditions, that is, a device
Table 3.
soldered in a circuit board for surface-mount packages.
Parameter Rating
Supply Voltage 6 V
Table 4. Thermal Characteristics
Input Voltage VSS − 0.3 V to VDD + 0.3 V
Package Type θJA θJC Unit
Input Current ±10 mA 5-Lead TSOT-23 (UJ-5) 207 61 °C/W Differential Input Voltage ±6 V 5-Lead SC70 (KS-5) 376 126 °C/W Output Short-Circuit Duration to GND Indefinite 8-Lead MSOP (RM-8) 210 45 °C/W Storage Temperature Range −65°C to +150°C 8-Lead SOIC_N (R-8) 158 43 °C/W Operating Temperature Range −40°C to +125°C 8-Lead LFCSP (CP-8-21) 81 20 °C/W Junction Temperature Range −65°C to +150°C 14-Lead SOIC_N (R-14) 120 36 °C/W Lead Temperature (Soldering, 60 sec) 300°C 14-Lead TSSOP (RU-14) 180 35 °C/W ESD AD8613 HBM ±4000 V FICDM ±1000 V
ESD CAUTION
ESD AD8617 HBM ±3000 V FICDM ±1000 V MM ±100 V ESD AD8619 HBM ±4000 V FICDM ±1250 V MM ±200 V Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. H | Page 5 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PIN CONFIGURATIONS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS
T
THERMAL RESISTANCE
A = 25°C, unless otherwise noted. θJA is specified for the worst-case conditions, that is, a device
Table 3.
soldered in a circuit board for surface-mount packages.
Parameter Rating
Supply Voltage 6 V
Table 4. Thermal Characteristics
Input Voltage VSS − 0.3 V to VDD + 0.3 V
Package Type θJA θJC Unit
Input Current ±10 mA 5-Lead TSOT-23 (UJ-5) 207 61 °C/W Differential Input Voltage ±6 V 5-Lead SC70 (KS-5) 376 126 °C/W Output Short-Circuit Duration to GND Indefinite 8-Lead MSOP (RM-8) 210 45 °C/W Storage Temperature Range −65°C to +150°C 8-Lead SOIC_N (R-8) 158 43 °C/W Operating Temperature Range −40°C to +125°C 8-Lead LFCSP (CP-8-21) 81 20 °C/W Junction Temperature Range −65°C to +150°C 14-Lead SOIC_N (R-14) 120 36 °C/W Lead Temperature (Soldering, 60 sec) 300°C 14-Lead TSSOP (RU-14) 180 35 °C/W ESD AD8613 HBM ±4000 V FICDM ±1000 V
ESD CAUTION
ESD AD8617 HBM ±3000 V FICDM ±1000 V MM ±100 V ESD AD8619 HBM ±4000 V FICDM ±1250 V MM ±200 V Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. H | Page 5 of 16 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION PIN CONFIGURATIONS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE AUTOMOTIVE PRODUCTS
