link to page 5 link to page 5 link to page 5 ADXL354/ADXL355Data SheetParameterTest Conditions/CommentsMinTypMaxUnit OUTPUT AMPLIFIER Swing No load 0.03 V1P8ANA − 0.03 V Output Series Resistance 32 kΩ TEMPERATURE SENSOR Output at 25°C 892.2 mV Scale Factor 3.0 mV/°C TEMPERATURE Operating Temperature Range −40 +125 °C 1 The resonant frequency is a sensor characteristic. An integrated analog 1.5 kHz (−6 dB) sinc low-pass filter that cannot be bypassed limits the actual output response. 2 The temperature change is −40°C to +25°C or +25°C to +125°C. 3 Repeatability is predicted for a 10 year life and includes shifts due to the high temperature operating life test (HTOL) (TA = 150°C, VSUPPLY = 3.6 V, and 1000 hours), temperature cycling (−55°C to +125°C and 1000 cycles), velocity random walk, broadband noise, and temperature hysteresis. 4 The VRE measurement is the shift in dc offset while the device is subject to 2.5 g rms of random vibration from 50 Hz to 2 kHz. The device under test (DUT) is configured for the ±2 g range and an output data rate of 4 kHz. The VRE scales with the range setting. 5 When V1P8ANA and V1P8DIG are generated internally, VSUPPLY is valid. To disable the LDO and drive V1P8ANA and V1P8DIG externally, connect VSUPPLY to VSS. 6 Standby to measurement mode; valid when the output is within 1 mg of the final value. DIGITAL OUTPUT FOR THE ADXL355 TA = 25°C, VSUPPLY = 3.3 V, x-axis acceleration and y-axis acceleration = 0 g, and z-axis acceleration = 1 g, and output data rate (ODR) = 500 Hz, unless otherwise noted. Note that multifunction pin names may be referenced by their relevant function only. Table 2. ParameterTest Conditions/CommentsMinTypMaxUnit SENSOR INPUT Each axis Output Full Scale Range (FSR) User selectable ±2.048 g ±4.096 g ±8.192 g Nonlinearity ±2 g 0.1 % FS Cross Axis Sensitivity 1 % SENSITIVITY Each axis X-Axis, Y-Axis, and Z-Axis Sensitivity ±2 g 235,520 256,000 276,480 LSB/g ±4 g 117,760 128,000 138,240 LSB/g ±8 g 58,880 64,000 69,120 LSB/g X-Axis, Y-Axis, and Z-Axis Scale Factor ±2 g 3.9 µg/LSB ±4 g 7.8 µg/LSB ±8 g 15.6 µg/LSB Sensitivity Change due to Temperature −40°C to +125°C ±0.01 %/°C 0 g OFFSET Each axis, ±2 g X-Axis, Y-Axis, and Z-Axis 0 g Output −75 ±25 +75 mg 0 g Offset vs. Temperature (X-Axis, Y-Axis, and Z-Axis)1 −40°C to +125°C −0.15 ±0.02 +0.15 mg/°C Repeatability2 X-axis and y-axis ±3.5 mg Z-axis ±9 mg Vibration Rectification3 ±2 g range, in a 1 g orientation, <0.4 g offset due to 2.5 g rms vibration NOISE DENSITY ±2 g X-Axis, Y-Axis, and Z-Axis 25 µg/√Hz Velocity Random Walk X-axis and y-axis 9 µm/sec/√Hr Z-axis 13 µm/sec/√Hr OUTPUT DATA RATE AND BANDWIDTH Low-Pass Filter Passband Frequency User programmable, Register 0x28 1 1000 Hz High-Pass Filter Passband Frequency When Enabled User programmable, Register 0x28 0.0095 10 Hz (Disabled by Default) for 4 kHz ODR Rev. 0 | Page 4 of 42 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAMS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ANALOG OUTPUT FOR THE ADXL354 DIGITAL OUTPUT FOR THE ADXL355 SPI DIGITAL INTERFACE CHARACTERISTICS FOR THE ADXL355 I2C DIGITAL INTERFACE CHARACTERISTICS FOR THE ADXL355 ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS ROOT ALLAN VARIANCE (RAV) ADXL355 CHARACTERISTICS THEORY OF OPERATION ANALOG OUTPUT DIGITAL OUTPUT AXES OF ACCELERATION SENSITIVITY POWER SEQUENCING POWER SUPPLY DESCRIPTION VSUPPLY V1P8ANA V1P8DIG VDDIO OVERRANGE PROTECTION SELF TEST FILTER SERIAL COMMUNICATIONS SPI PROTOCOL I2C PROTOCOL READING ACCELERATION OR TEMPERATURE DATA FROM THE INTERFACE FIFO INTERRUPTS DATA_RDY DRDY PIN FIFO_FULL FIFO_OVR ACTIVITY NVM_BUSY EXTERNAL SYNCHRONIZATION AND INTERPOLATION EXT_SYNC = 00—No External Sync or Interpolation EXT_SYNC = 10—External Sync with Interpolation EXT_SYNC = 01—External Sync and External Clock ADXL355 REGISTER MAP REGISTER DEFINITIONS ANALOG DEVICES ID REGISTER Address: 0x00, Reset: 0xAD, Name: DEVID_AD ANALOG DEVICES MEMS ID REGISTER Address: 0x01, Reset: 0x1D, Name: DEVID_MST DEVICE ID REGISTER Address: 0x02, Reset: 0xED, Name: PARTID PRODUCT REVISION ID REGISTER Address: 0x03, Reset: 0x00, Name: REVID STATUS REGISTER Address: 0x04, Reset: 0x00, Name: STATUS FIFO ENTRIES REGISTER Address: 0x05, Reset: 0x00, Name: FIFO_ENTRIES TEMPERATURE DATA REGISTERS Address: 0x06, Reset: 0x00, Name: TEMP2 Address: 0x07, Reset: 0x00, Name: TEMP1 X-AXIS DATA REGISTERS Address: 0x08, Reset: 0x00, Name: XDATA3 Address: 0x09, Reset: 0x00, Name: XDATA2 Address: 0x0A, Reset: 0x00, Name: XDATA1 Y-AXIS DATA REGISTERS Address: 0x0B, Reset: 0x00, Name: YDATA3 Address: 0x0C, Reset: 0x00, Name: YDATA2 Address: 0x0D, Reset: 0x00, Name: YDATA1 Z-AXIS DATA REGISTERS Address: 0x0E, Reset: 0x00, Name: ZDATA3 Address: 0x0F, Reset: 0x00, Name: ZDATA2 Address: 0x10, Reset: 0x00, Name: ZDATA1 FIFO ACCESS REGISTER Address: 0x11, Reset: 0x00, Name: FIFO_DATA X-AXIS OFFSET TRIM REGISTERS Address: 0x1E, Reset: 0x00, Name: OFFSET_X_H Address: 0x1F, Reset: 0x00, Name: OFFSET_X_L Y-AXIS OFFSET TRIM REGISTERS Address: 0x20, Reset: 0x00, Name: OFFSET_Y_H Address: 0x21, Reset: 0x00, Name: OFFSET_Y_L Z-AXIS OFFSET TRIM REGISTERS Address: 0x22, Reset: 0x00, Name: OFFSET_Z_H Address: 0x23, Reset: 0x00, Name: OFFSET_Z_L ACTIVITY ENABLE REGISTER Address: 0x24, Reset: 0x00, Name: ACT_EN ACTIVITY THRESHOLD REGISTERS Address: 0x25, Reset: 0x00, Name: ACT_THRESH_H Address: 0x26, Reset: 0x00, Name: ACT_THRESH_L ACTIVITY COUNT REGISTER Address: 0x27, Reset: 0x01, Name: ACT_COUNT FILTER SETTINGS REGISTER Address: 0x28, Reset: 0x00, Name: Filter FIFO SAMPLES REGISTER Address: 0x29, Reset: 0x60, Name: FIFO_SAMPLES INTERRUPT PIN (INTx) FUNCTION MAP REGISTER Address: 0x2A, Reset: 0x00, Name: INT_MAP DATA SYNCHRONIZATION Address: 0x2B, Reset: 0x00, Name: Sync I2C SPEED, INTERRUPT POLARITY, AND RANGE REGISTER Address: 0x2C, Reset: 0x81, Name: Range POWER CONTROL REGISTER Address: 0x2D, Reset: 0x01, Name: POWER_CTL SELF TEST REGISTER Address: 0x2E, Reset: 0x00, Name: SELF_TEST RESET REGISTER Address: 0x2F, Reset: 0x00, Name: Reset RECOMMENDED SOLDERING PROFILE PCB FOOTPRINT PATTERN PACKAGING AND ORDERING INFORMATION OUTLINE DIMENSIONS BRANDING INFORMATION ORDERING GUIDE