Datasheet EFR32MG22 (Silicon Labs) - 9
| Manufacturer | Silicon Labs |
| Description | Wireless Gecko SoC Family |
| Pages / Page | 101 / 9 — 3.2.8 RFSENSE Interface. 3.3 General Purpose Input/Output (GPIO). 3.4 … |
| File Format / Size | PDF / 1.3 Mb |
| Document Language | English |
3.2.8 RFSENSE Interface. 3.3 General Purpose Input/Output (GPIO). 3.4 Clocking. 3.4.1 Clock Management Unit (CMU)
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Text Version of Document
link to page 16 EFR32MG22 Wireless Gecko SoC Family Data Sheet System Overview
3.2.8 RFSENSE Interface
The RFSENSE block allows the device to remain in EM2, EM3 or EM4 and wake when RF energy above a specified threshold is detec- ted. When operated in selective mode, the RFSENSE block performs OOK preamble and sync word detection, preventing false wake- up events.
3.3 General Purpose Input/Output (GPIO)
EFR32MG22 has up to 26 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input. More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin. The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to several GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripher- als. The GPIO subsystem supports asynchronous external pin interrupts. All of the pins on ports A and port B are EM2 capable. These pins may be used by Low-Energy peripherals in EM2/3 and may also be used as EM2/3 pin wake-ups. Pins on ports C and D are latched/retained in their current state when entering EM2 until EM2 exit upon which internal peripherals could once again drive those pads. A few GPIOs also have EM4 wake functionality. These pins are listed in the Alternate Function Table.
3.4 Clocking 3.4.1 Clock Management Unit (CMU)
The Clock Management Unit controls oscillators and clocks in the EFR32MG22. Individual enabling and disabling of clocks to all periph- eral modules is performed by the CMU. The CMU also controls enabling and configuration of the oscillators. A high degree of flexibility allows software to optimize energy consumption in any specific application by minimizing power dissipation in unused peripherals and oscillators.
3.4.2 Internal and External Oscillators
The EFR32MG22 supports two crystal oscillators and fully integrates four RC oscillators, listed below. • A high frequency crystal oscillator (HFXO) with integrated load capacitors, tunable in small steps, provides a precise timing refer- ence for the MCU. The HFXO provides excellent RF clocking performance using a 38.4 MHz crystal. The HFXO can also support an external clock source such as a TCXO for applications that require an extremely accurate clock frequency over temperature. • A 32.768 kHz crystal oscillator (LFXO) provides an accurate timing reference for low energy modes. • An integrated high frequency RC oscillator (HFRCO) is available for the MCU system, when crystal accuracy is not required. The HFRCO employs fast start-up at minimal energy consumption combined with a wide frequency range, from 1 MHz to 76.8 MHz. • An integrated fast start-up RC oscillator (FSRCO) that runs at a fixed 20 MHz • An integrated low frequency 32.768 kHz RC oscillator (LFRCO) for low power operation without an external crystal. Precision mode enables periodic recalibration against the 38.4 MHz HFXO crystal to improve accuracy to +/- 500 ppm, suitable for BLE sleep inter- val timing. • An integrated ultra-low frequency 1 kHz RC oscillator (ULFRCO) is available to provide a timing reference at the lowest energy con- sumption in low energy modes.
3.5 Counters/Timers and PWM 3.5.1 Timer/Counter (TIMER)
TIMER peripherals keep track of timing, count events, generate PWM outputs and trigger timed actions in other peripherals through the Peripheral Reflex System (PRS). The core of each TIMER is a 16-bit or 32-bit counter with up to 3 compare/capture channels. Each channel is configurable in one of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In compare mode, the channel output reflects the comparison of the counter to a programmed threshold value. In PWM mode, the TIMER supports generation of pulse-width modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the compare registers. In addition some timers offer dead-time insertion. See 3.13 Configuration Summary for information on the feature set of each timer.
silabs.com
| Building a more connected world. Preliminary Rev. 0.5 | 9 Document Outline 1. Feature List 2. Ordering Information 3. System Overview 3.1 Introduction 3.2 Radio 3.2.1 Antenna Interface 3.2.2 Fractional-N Frequency Synthesizer 3.2.3 Receiver Architecture 3.2.4 Transmitter Architecture 3.2.5 Packet and State Trace 3.2.6 Data Buffering 3.2.7 Radio Controller (RAC) 3.2.8 RFSENSE Interface 3.3 General Purpose Input/Output (GPIO) 3.4 Clocking 3.4.1 Clock Management Unit (CMU) 3.4.2 Internal and External Oscillators 3.5 Counters/Timers and PWM 3.5.1 Timer/Counter (TIMER) 3.5.2 Low Energy Timer (LETIMER) 3.5.3 Real Time Clock with Capture (RTCC) 3.5.4 Back-Up Real Time Counter 3.5.5 Watchdog Timer (WDOG) 3.6 Communications and Other Digital Peripherals 3.6.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) 3.6.2 Enhanced Universal Asynchronous Receiver/Transmitter (EUART) 3.6.3 Inter-Integrated Circuit Interface (I2C) 3.6.4 Peripheral Reflex System (PRS) 3.6.5 Pulse Density Modulation (PDM) Interface 3.7 Security Features 3.7.1 Secure Boot with Root of Trust and Secure Loader (RTSL) 3.7.2 Cryptographic Accelerator 3.7.3 True Random Number Generator 3.7.4 Secure Debug with Lock/Unlock 3.8 Analog 3.8.1 Analog to Digital Converter (IADC) 3.9 Power 3.9.1 Energy Management Unit (EMU) 3.9.2 Voltage Scaling 3.9.3 DC-DC Converter 3.9.4 Power Domains 3.10 Reset Management Unit (RMU) 3.11 Core and Memory 3.11.1 Processor Core 3.11.2 Memory System Controller (MSC) 3.11.3 Linked Direct Memory Access Controller (LDMA) 3.12 Memory Map 3.13 Configuration Summary 4. Electrical Specifications 4.1 Electrical Characteristics 4.2 Absolute Maximum Ratings 4.3 General Operating Conditions 4.4 DC-DC Converter 4.4.1 DC-DC Operating Limits 4.5 Thermal Characteristics 4.6 Current Consumption 4.6.1 MCU current consumption using DC-DC at 3.0 V input 4.6.2 MCU current consumption at 3.0 V 4.6.3 MCU current consumption at 1.8 V 4.6.4 Radio current consumption at 3.0V using DCDC 4.7 Flash Characteristics 4.8 Wake Up, Entry, and Exit times 4.9 RFSENSE Low-energy Wake-on-RF 4.10 2.4 GHz RF Transceiver Characteristics 4.10.1 RF Transmitter Characteristics 4.10.1.1 RF Transmitter General Characteristics for the 2.4 GHz Band 4.10.1.2 RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band 4.10.1.3 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate 4.10.1.4 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate 4.10.1.5 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate 4.10.1.6 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate 4.10.2 RF Receiver Characteristics 4.10.2.1 RF Receiver General Characteristics for the 2.4 GHz Band 4.10.2.2 RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band 4.10.2.3 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate 4.10.2.4 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate 4.10.2.5 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate 4.10.2.6 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate 4.11 Oscillators 4.11.1 High Frequency Crystal Oscillator 4.11.2 Low Frequency Crystal Oscillator 4.11.3 High Frequency RC Oscillator (HFRCO) 4.11.4 Fast Start_Up RC Oscillator (FSRCO) 4.11.5 Precision Low Frequency RC Oscillator (LFRCO) 4.11.6 Ultra Low Frequency RC Oscillator 4.12 GPIO Pins (3V GPIO pins) 4.13 Analog to Digital Converter (IADC) 4.14 Temperature Sense 4.15 Brown Out Detectors 4.15.1 DVDD BOD 4.15.2 LE DVDD BOD 4.15.3 AVDD and IOVDD BODs 4.16 PDM Timing Specifications 4.16.1 Pulse Density Modulator (PDM), Common DBUS 4.17 USART SPI Master Timing 4.17.1 SPI Master Timing, Voltage Scaling = VSCALE2 4.17.2 SPI Master Timing, Voltage Scaling = VSCALE1 4.18 USART SPI Slave Timing 4.18.1 SPI Slave Timing, Voltage Scaling = VSCALE2 4.18.2 SPI Slave Timing, Voltage Scaling = VSCALE1 4.19 I2C Electrical Specifications 4.19.1 I2C Standard-mode (Sm) 4.19.2 I2C Fast-mode (Fm) 4.19.3 I2C Fast-mode Plus (Fm+) 4.20 Typical Performance Curves 4.20.1 Supply Current 4.20.2 RF Characteristics 4.20.3 DC-DC Converter 5. Typical Connections 5.1 Power 5.2 RF Matching Networks 5.2.1 2.4 GHz Matching Network 5.3 Other Connections 6. Pin Definitions 6.1 QFN40 Device Pinout 6.2 TQFN32 Device Pinout 6.3 QFN32 Device Pinout 6.4 Alternate Function Table 6.5 Analog Peripheral Connectivity 6.6 Digital Peripheral Connectivity 7. QFN32 Package Specifications 7.1 QFN32 Package Dimensions 7.2 QFN32 PCB Land Pattern 7.3 QFN32 Package Marking 8. TQFN32 Package Specifications 8.1 TQFN32 Package Dimensions 8.2 TQFN32 PCB Land Pattern 8.3 TQFN32 Package Marking 9. QFN40 Package Specifications 9.1 QFN40 Package Dimensions 9.2 QFN40 PCB Land Pattern 9.3 QFN40 Package Marking 10. Revision History
3.2.8 RFSENSE Interface
The RFSENSE block allows the device to remain in EM2, EM3 or EM4 and wake when RF energy above a specified threshold is detec- ted. When operated in selective mode, the RFSENSE block performs OOK preamble and sync word detection, preventing false wake- up events.
3.3 General Purpose Input/Output (GPIO)
EFR32MG22 has up to 26 General Purpose Input/Output pins. Each GPIO pin can be individually configured as either an output or input. More advanced configurations including open-drain, open-source, and glitch-filtering can be configured for each individual GPIO pin. The GPIO pins can be overridden by peripheral connections, like SPI communication. Each peripheral connection can be routed to several GPIO pins on the device. The input value of a GPIO pin can be routed through the Peripheral Reflex System to other peripher- als. The GPIO subsystem supports asynchronous external pin interrupts. All of the pins on ports A and port B are EM2 capable. These pins may be used by Low-Energy peripherals in EM2/3 and may also be used as EM2/3 pin wake-ups. Pins on ports C and D are latched/retained in their current state when entering EM2 until EM2 exit upon which internal peripherals could once again drive those pads. A few GPIOs also have EM4 wake functionality. These pins are listed in the Alternate Function Table.
3.4 Clocking 3.4.1 Clock Management Unit (CMU)
The Clock Management Unit controls oscillators and clocks in the EFR32MG22. Individual enabling and disabling of clocks to all periph- eral modules is performed by the CMU. The CMU also controls enabling and configuration of the oscillators. A high degree of flexibility allows software to optimize energy consumption in any specific application by minimizing power dissipation in unused peripherals and oscillators.
3.4.2 Internal and External Oscillators
The EFR32MG22 supports two crystal oscillators and fully integrates four RC oscillators, listed below. • A high frequency crystal oscillator (HFXO) with integrated load capacitors, tunable in small steps, provides a precise timing refer- ence for the MCU. The HFXO provides excellent RF clocking performance using a 38.4 MHz crystal. The HFXO can also support an external clock source such as a TCXO for applications that require an extremely accurate clock frequency over temperature. • A 32.768 kHz crystal oscillator (LFXO) provides an accurate timing reference for low energy modes. • An integrated high frequency RC oscillator (HFRCO) is available for the MCU system, when crystal accuracy is not required. The HFRCO employs fast start-up at minimal energy consumption combined with a wide frequency range, from 1 MHz to 76.8 MHz. • An integrated fast start-up RC oscillator (FSRCO) that runs at a fixed 20 MHz • An integrated low frequency 32.768 kHz RC oscillator (LFRCO) for low power operation without an external crystal. Precision mode enables periodic recalibration against the 38.4 MHz HFXO crystal to improve accuracy to +/- 500 ppm, suitable for BLE sleep inter- val timing. • An integrated ultra-low frequency 1 kHz RC oscillator (ULFRCO) is available to provide a timing reference at the lowest energy con- sumption in low energy modes.
3.5 Counters/Timers and PWM 3.5.1 Timer/Counter (TIMER)
TIMER peripherals keep track of timing, count events, generate PWM outputs and trigger timed actions in other peripherals through the Peripheral Reflex System (PRS). The core of each TIMER is a 16-bit or 32-bit counter with up to 3 compare/capture channels. Each channel is configurable in one of three modes. In capture mode, the counter state is stored in a buffer at a selected input event. In compare mode, the channel output reflects the comparison of the counter to a programmed threshold value. In PWM mode, the TIMER supports generation of pulse-width modulation (PWM) outputs of arbitrary waveforms defined by the sequence of values written to the compare registers. In addition some timers offer dead-time insertion. See 3.13 Configuration Summary for information on the feature set of each timer.
silabs.com
| Building a more connected world. Preliminary Rev. 0.5 | 9 Document Outline 1. Feature List 2. Ordering Information 3. System Overview 3.1 Introduction 3.2 Radio 3.2.1 Antenna Interface 3.2.2 Fractional-N Frequency Synthesizer 3.2.3 Receiver Architecture 3.2.4 Transmitter Architecture 3.2.5 Packet and State Trace 3.2.6 Data Buffering 3.2.7 Radio Controller (RAC) 3.2.8 RFSENSE Interface 3.3 General Purpose Input/Output (GPIO) 3.4 Clocking 3.4.1 Clock Management Unit (CMU) 3.4.2 Internal and External Oscillators 3.5 Counters/Timers and PWM 3.5.1 Timer/Counter (TIMER) 3.5.2 Low Energy Timer (LETIMER) 3.5.3 Real Time Clock with Capture (RTCC) 3.5.4 Back-Up Real Time Counter 3.5.5 Watchdog Timer (WDOG) 3.6 Communications and Other Digital Peripherals 3.6.1 Universal Synchronous/Asynchronous Receiver/Transmitter (USART) 3.6.2 Enhanced Universal Asynchronous Receiver/Transmitter (EUART) 3.6.3 Inter-Integrated Circuit Interface (I2C) 3.6.4 Peripheral Reflex System (PRS) 3.6.5 Pulse Density Modulation (PDM) Interface 3.7 Security Features 3.7.1 Secure Boot with Root of Trust and Secure Loader (RTSL) 3.7.2 Cryptographic Accelerator 3.7.3 True Random Number Generator 3.7.4 Secure Debug with Lock/Unlock 3.8 Analog 3.8.1 Analog to Digital Converter (IADC) 3.9 Power 3.9.1 Energy Management Unit (EMU) 3.9.2 Voltage Scaling 3.9.3 DC-DC Converter 3.9.4 Power Domains 3.10 Reset Management Unit (RMU) 3.11 Core and Memory 3.11.1 Processor Core 3.11.2 Memory System Controller (MSC) 3.11.3 Linked Direct Memory Access Controller (LDMA) 3.12 Memory Map 3.13 Configuration Summary 4. Electrical Specifications 4.1 Electrical Characteristics 4.2 Absolute Maximum Ratings 4.3 General Operating Conditions 4.4 DC-DC Converter 4.4.1 DC-DC Operating Limits 4.5 Thermal Characteristics 4.6 Current Consumption 4.6.1 MCU current consumption using DC-DC at 3.0 V input 4.6.2 MCU current consumption at 3.0 V 4.6.3 MCU current consumption at 1.8 V 4.6.4 Radio current consumption at 3.0V using DCDC 4.7 Flash Characteristics 4.8 Wake Up, Entry, and Exit times 4.9 RFSENSE Low-energy Wake-on-RF 4.10 2.4 GHz RF Transceiver Characteristics 4.10.1 RF Transmitter Characteristics 4.10.1.1 RF Transmitter General Characteristics for the 2.4 GHz Band 4.10.1.2 RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band 4.10.1.3 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate 4.10.1.4 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate 4.10.1.5 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate 4.10.1.6 RF Transmitter Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate 4.10.2 RF Receiver Characteristics 4.10.2.1 RF Receiver General Characteristics for the 2.4 GHz Band 4.10.2.2 RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band 4.10.2.3 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate 4.10.2.4 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate 4.10.2.5 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate 4.10.2.6 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate 4.11 Oscillators 4.11.1 High Frequency Crystal Oscillator 4.11.2 Low Frequency Crystal Oscillator 4.11.3 High Frequency RC Oscillator (HFRCO) 4.11.4 Fast Start_Up RC Oscillator (FSRCO) 4.11.5 Precision Low Frequency RC Oscillator (LFRCO) 4.11.6 Ultra Low Frequency RC Oscillator 4.12 GPIO Pins (3V GPIO pins) 4.13 Analog to Digital Converter (IADC) 4.14 Temperature Sense 4.15 Brown Out Detectors 4.15.1 DVDD BOD 4.15.2 LE DVDD BOD 4.15.3 AVDD and IOVDD BODs 4.16 PDM Timing Specifications 4.16.1 Pulse Density Modulator (PDM), Common DBUS 4.17 USART SPI Master Timing 4.17.1 SPI Master Timing, Voltage Scaling = VSCALE2 4.17.2 SPI Master Timing, Voltage Scaling = VSCALE1 4.18 USART SPI Slave Timing 4.18.1 SPI Slave Timing, Voltage Scaling = VSCALE2 4.18.2 SPI Slave Timing, Voltage Scaling = VSCALE1 4.19 I2C Electrical Specifications 4.19.1 I2C Standard-mode (Sm) 4.19.2 I2C Fast-mode (Fm) 4.19.3 I2C Fast-mode Plus (Fm+) 4.20 Typical Performance Curves 4.20.1 Supply Current 4.20.2 RF Characteristics 4.20.3 DC-DC Converter 5. Typical Connections 5.1 Power 5.2 RF Matching Networks 5.2.1 2.4 GHz Matching Network 5.3 Other Connections 6. Pin Definitions 6.1 QFN40 Device Pinout 6.2 TQFN32 Device Pinout 6.3 QFN32 Device Pinout 6.4 Alternate Function Table 6.5 Analog Peripheral Connectivity 6.6 Digital Peripheral Connectivity 7. QFN32 Package Specifications 7.1 QFN32 Package Dimensions 7.2 QFN32 PCB Land Pattern 7.3 QFN32 Package Marking 8. TQFN32 Package Specifications 8.1 TQFN32 Package Dimensions 8.2 TQFN32 PCB Land Pattern 8.3 TQFN32 Package Marking 9. QFN40 Package Specifications 9.1 QFN40 Package Dimensions 9.2 QFN40 PCB Land Pattern 9.3 QFN40 Package Marking 10. Revision History
