Datasheet HMC1049SCPZ-EP (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | GaAs, pHEMT, MMIC, Low Noise Amplifier, 0.3 GHz to 20 GHz |
| Pages / Page | 10 / 5 — Enhanced Product. HMC1049SCPZ-EP. ABSOLUTE MAXIMUM RATINGS Table 5. … |
| File Format / Size | PDF / 267 Kb |
| Document Language | English |
Enhanced Product. HMC1049SCPZ-EP. ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE. Parameter. Rating
Model Line for this Datasheet
Text Version of Document
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Enhanced Product HMC1049SCPZ-EP ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Drain Bias Voltage (VDD) 10 V (PCB) design and operating environment. Careful attention to Drain Bias Voltage (RFOUT/VDD) 7 V PCB thermal design is required. RF Input Power 18 dBm θJA is the natural convection junction to ambient thermal Gate Bias Voltage (VGG) −2 V to +0.2 V resistance measured in a one cubic foot sealed enclosure. θJC is Junction Temperature (TJ) 175°C the junction to case thermal resistance. Continuous Power Dissipation, P 1 DISS TCASE = 85°C 3.34 W
Table 6. Thermal Resistance
T
1 2
CASE = 105°C 2.60 W
Package Type θJA θJC Unit
Peak Reflow Temperature 260°C CP-32-29 61.1 8.9 °C/W Temperature 1 Storage Temperature −65°C to +150°C Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board. See JEDEC JESD51. Operating Temperature −55°C to +105°C 2 Thermal impedance simulated values are based on a JEDEC 1S0P thermal ESD Sensitivity, Human Body Model (HBM) Class 1A test board. See JEDEC JESD51.
POWER DERATING CURVES
1 For maximum power dissipation vs. case temperature, see Figure 2. Stresses at or above those listed under Absolute Maximum Figure 2 shows the maximum power dissipation vs. case Ratings may cause permanent damage to the product. This is a temperature. stress rating only; functional operation of the product at these
4.0
or any other conditions above those indicated in the operational
3.5
section of this specification is not implied. Operation beyond
) W (
the maximum operating conditions for extended periods may
N 3.0
affect product reliability.
TIO A IP 2.5 ISS D 2.0 R E W O 1.5 P M U 1.0 IM X A M 0.5 0 –55 –35 –15 5 25 45 65 85 105 125
102
CASE TEMPERATURE (°C)
17190- Figure 2. Maximum Power Dissipation vs. Case Temperature
ESD CAUTION
Rev. 0 | Page 5 of 10 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 0.3 GHZ TO 1 GHZ FREQUENCY RANGE 1 GHZ TO 14 GHZ FREQUENCY RANGE 14 GHZ TO 20 GHZ FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE POWER DERATING CURVES ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS PACKAGING AND ORDERING INFORMATION OUTLINE DIMENSIONS ORDERING GUIDE
Enhanced Product HMC1049SCPZ-EP ABSOLUTE MAXIMUM RATINGS Table 5. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Drain Bias Voltage (VDD) 10 V (PCB) design and operating environment. Careful attention to Drain Bias Voltage (RFOUT/VDD) 7 V PCB thermal design is required. RF Input Power 18 dBm θJA is the natural convection junction to ambient thermal Gate Bias Voltage (VGG) −2 V to +0.2 V resistance measured in a one cubic foot sealed enclosure. θJC is Junction Temperature (TJ) 175°C the junction to case thermal resistance. Continuous Power Dissipation, P 1 DISS TCASE = 85°C 3.34 W
Table 6. Thermal Resistance
T
1 2
CASE = 105°C 2.60 W
Package Type θJA θJC Unit
Peak Reflow Temperature 260°C CP-32-29 61.1 8.9 °C/W Temperature 1 Storage Temperature −65°C to +150°C Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board. See JEDEC JESD51. Operating Temperature −55°C to +105°C 2 Thermal impedance simulated values are based on a JEDEC 1S0P thermal ESD Sensitivity, Human Body Model (HBM) Class 1A test board. See JEDEC JESD51.
POWER DERATING CURVES
1 For maximum power dissipation vs. case temperature, see Figure 2. Stresses at or above those listed under Absolute Maximum Figure 2 shows the maximum power dissipation vs. case Ratings may cause permanent damage to the product. This is a temperature. stress rating only; functional operation of the product at these
4.0
or any other conditions above those indicated in the operational
3.5
section of this specification is not implied. Operation beyond
) W (
the maximum operating conditions for extended periods may
N 3.0
affect product reliability.
TIO A IP 2.5 ISS D 2.0 R E W O 1.5 P M U 1.0 IM X A M 0.5 0 –55 –35 –15 5 25 45 65 85 105 125
102
CASE TEMPERATURE (°C)
17190- Figure 2. Maximum Power Dissipation vs. Case Temperature
ESD CAUTION
Rev. 0 | Page 5 of 10 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 0.3 GHZ TO 1 GHZ FREQUENCY RANGE 1 GHZ TO 14 GHZ FREQUENCY RANGE 14 GHZ TO 20 GHZ FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE POWER DERATING CURVES ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS PACKAGING AND ORDERING INFORMATION OUTLINE DIMENSIONS ORDERING GUIDE
