Datasheet ADPA7007CHIP (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | GaAs, pHEMT, MMIC,1 W Power Amplifier, 18 GHz to 44 GHz |
| Pages / Page | 25 / 5 — Data Sheet. ADPA7007CHIP. ABSOLUTE MAXIMUM RATINGS Table 4. ELECTROSTATIC … |
| File Format / Size | PDF / 531 Kb |
| Document Language | English |
Data Sheet. ADPA7007CHIP. ABSOLUTE MAXIMUM RATINGS Table 4. ELECTROSTATIC DISCHARGE (ESD) RATINGS. Parameter. Rating
Model Line for this Datasheet
Text Version of Document
Data Sheet ADPA7007CHIP ABSOLUTE MAXIMUM RATINGS Table 4. ELECTROSTATIC DISCHARGE (ESD) RATINGS Parameter Rating
The following ESD information is provided for handling of Drain Bias Voltage (VDDx) 6.0 V ESD-sensitive devices in an ESD protected area only. VGGx −1.5 to 0 V RF Input Power (RFIN) 18 dBm Human body model (HBM) per ANSI/ESDA/JEDDEC JS-001. Continuous Power Dissipation (PDISS), 13.6 W
ESD Ratings ADPA7007CHIP
TA = 85°C (Derate 149.2 mW/°C Above 85°C) Temperature Range
Table 7. ADPA7007CHIP, 10-Pad CHIP
Storage −65°C to +150°C
ESD Model Withstand Threshold (V) Class
Operating −55°C to +85°C HBM ±250 1A Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to system design and operating environment. Careful attention to the printed circuit board (PCB) thermal design is required. θ JC is the channel to case thermal resistance, channel to bottom of die using die attach epoxy.
Table 5. Thermal Resistance Package Type θJC Unit
C-10-11 6.6 °C/W
Table 6. Reliability Information Parameter Temperature (°C)
Junction Temperature to Maintain 1,000,000 175 Hour Mean Time to Failure (MTTF) Nominal Junction Temperature (TJ = 85°C, 131.2 VDD = 5 V, IDQ = 1400 mA) Rev. 0 | Page 5 of 25 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 18 GHz TO 22 GHz FREQUENCY RANGE 22 GHz TO 36 GHz FREQUENCY RANGE 36 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ELECTROSTATIC DISCHARGE (ESD) RATINGS ESD Ratings ADPA7007CHIP ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS CONSTANT IDD OPERATION THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GAAS MMICS Handling Precautions Mounting Wire Bonding BIASING ADPA7007CHIP WITH THE HMC980LP4E APPLICATION CIRCUIT SETUP LIMITING VGATE FOR ADPA7007CHIP VGGx ABSOLUTE MAXIMUM RATING REQUIREMENT HMC980LP4E BIAS SEQUENCE Power-Up Sequence Power-Down Sequence CONSTANT DRAIN CURRENT BIASING vs. CONSTANT GATE VOLTAGE BIASING TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
The following ESD information is provided for handling of Drain Bias Voltage (VDDx) 6.0 V ESD-sensitive devices in an ESD protected area only. VGGx −1.5 to 0 V RF Input Power (RFIN) 18 dBm Human body model (HBM) per ANSI/ESDA/JEDDEC JS-001. Continuous Power Dissipation (PDISS), 13.6 W
ESD Ratings ADPA7007CHIP
TA = 85°C (Derate 149.2 mW/°C Above 85°C) Temperature Range
Table 7. ADPA7007CHIP, 10-Pad CHIP
Storage −65°C to +150°C
ESD Model Withstand Threshold (V) Class
Operating −55°C to +85°C HBM ±250 1A Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a
ESD CAUTION
stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to system design and operating environment. Careful attention to the printed circuit board (PCB) thermal design is required. θ JC is the channel to case thermal resistance, channel to bottom of die using die attach epoxy.
Table 5. Thermal Resistance Package Type θJC Unit
C-10-11 6.6 °C/W
Table 6. Reliability Information Parameter Temperature (°C)
Junction Temperature to Maintain 1,000,000 175 Hour Mean Time to Failure (MTTF) Nominal Junction Temperature (TJ = 85°C, 131.2 VDD = 5 V, IDQ = 1400 mA) Rev. 0 | Page 5 of 25 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 18 GHz TO 22 GHz FREQUENCY RANGE 22 GHz TO 36 GHz FREQUENCY RANGE 36 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ELECTROSTATIC DISCHARGE (ESD) RATINGS ESD Ratings ADPA7007CHIP ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS CONSTANT IDD OPERATION THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GAAS MMICS Handling Precautions Mounting Wire Bonding BIASING ADPA7007CHIP WITH THE HMC980LP4E APPLICATION CIRCUIT SETUP LIMITING VGATE FOR ADPA7007CHIP VGGx ABSOLUTE MAXIMUM RATING REQUIREMENT HMC980LP4E BIAS SEQUENCE Power-Up Sequence Power-Down Sequence CONSTANT DRAIN CURRENT BIASING vs. CONSTANT GATE VOLTAGE BIASING TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE
