Datasheet MOC3060, MOC3061, MOC3062, MOC3063 (Isocom) - 10
| Manufacturer | Isocom |
| Description | Zero Crossing Triac Output, 6 Pin |
| Pages / Page | 11 / 10 — MOC306x |
| File Format / Size | PDF / 3.2 Mb |
| Document Language | English |
MOC306x
Model Line for this Datasheet
Text Version of Document
MOC306x IR REFLOW SOLDERING TEMPERATURE PROFILE One Time Reflow Soldering is Recommended. Do not immerse device body in solder paste. 260°C T P T P - 5°C tP Max Ramp Up Rate Max Ramp Down Rate 3°C/s 6°C/s 217°C TL T L T 200°C smax TEMP (°C) T 150°C smin t s Preheat 60s – 120s 25°C TIME (s) Time 25°C to Peak Temperature Profile Details Conditions Preheat
- Min Temperature (TSMIN) 150°C - Max Temperature (TSMAX) 200°C - Time TSMIN to TSMAX (ts) 60s - 120s
Soldering Zone
- Peak Temperature (TP) 260°C - Time at Peak Temperature 10s max - Liquidous Temperature (TL) 217°C - Time within 5°C of Actual Peak Temperature (TP ̶ 5°C) 30s max - Time maintained above TL (tL) 60s - 100s - Ramp Up Rate (TL to TP) 3°C/s max - Ramp Down Rate (TP to TL) 6°C/s max Average Ramp Up Rate (Tsmax to TP) 3°C/s max Time 25°C to Peak Temperature 8 minutes max 10 05/02/2018 DD93230
- Min Temperature (TSMIN) 150°C - Max Temperature (TSMAX) 200°C - Time TSMIN to TSMAX (ts) 60s - 120s
Soldering Zone
- Peak Temperature (TP) 260°C - Time at Peak Temperature 10s max - Liquidous Temperature (TL) 217°C - Time within 5°C of Actual Peak Temperature (TP ̶ 5°C) 30s max - Time maintained above TL (tL) 60s - 100s - Ramp Up Rate (TL to TP) 3°C/s max - Ramp Down Rate (TP to TL) 6°C/s max Average Ramp Up Rate (Tsmax to TP) 3°C/s max Time 25°C to Peak Temperature 8 minutes max 10 05/02/2018 DD93230
