Datasheet KMA210 (NXP) - 3 Manufacturer NXP Description Programmable Angle Sensor Pages / Page 37 / 3 — Prod. 4. Functional. NXP Semiconductors. uct. dat. a sh. eet. diagram. … File Format / Size PDF / 586 Kb Document Language English
Prod. 4. Functional. NXP Semiconductors. uct. dat. a sh. eet. diagram. Rev. . 2 —. 7 Decem. ber 201. Progra. mmable an. KMA210. gle. sen. of 3. sor. Fig 1
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Model Line for this Datasheet Text Version of Document xxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx x xxxxxxxxxxxxxx xxxxxxxxxx xxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxx xxxxxxxxxxxxxx xxxxxx xx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxx xxxxx x xProd K4. Functional NXP Semiconductors MA 210uct dat a sh eet diagram VDD ANALOG ANALOG DIGITAL UNDERVOLTAGE VOLTAGE VOLTAGE VOLTAGE DETECTION/ REGULATOR REGULATOR REGULATOR POR (CLEAN) (SWITCHING) POR A ll inf POWER-LOSS POWER-LOSS or Cblock m DETECTION DETECTION ati on prRev GND ov. 2 — id LOW-PASS ed i FILTER output n thi differential buffer7 Decem amplifier ADC OSCILLATOR DAC OUT/DATA s doc umen TIPLEXER (MUX) LOW-PASS ONE-WIRE FILTER MUL INTERFACE t is sber 201 ubj ect to l GND C egal L1 di sc lai DIGITAL ANGULAR NON-VOLATILE TEST CLOCK OFFSET ANGLE SERIAL mer FILTER AND RANGE MEMORY CONTROL GENERATOR CORRECTION CALCULATION INTERFACE AVERAGING ADJUSTMENT DEMUX s . GND MAGNETORESISTIVE INTEGRATED SENSOR BRIDGES SIGNAL CONDITIONING INTEGRATED CIRCUIT CAPACITANCESProgra 001aan661mmable an © NXKMA210 P B.V . 20 1gle 1. A ll rsen ight3 s rof 3 essor er v ed7 Fig 1. Functional diagram of KMA210 . Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 2. Pinning information 3. Ordering information 4. Functional diagram 5. Functional description 5.1 Angular measurement directions 6. Analog output 7. Diagnostic features 7.1 CRC and EDC supervision 7.2 Magnet-loss detection 7.3 Power-loss detection 7.4 Broken bond wire detection 7.5 Low supply voltage detection and overvoltage protection 8. Limiting values 9. Recommended operating conditions 10. Thermal characteristics 11. Characteristics 12. Definition of errors 12.1 General 12.2 Hysteresis error 12.3 Linearity error 12.4 Microlinearity error 12.5 Temperature drift error 12.6 Angular error 13. Programming 13.1 General description 13.2 Timing characteristics 13.3 Sending and receiving data 13.3.1 Write access 13.3.2 Read access 13.3.3 Entering the command mode 13.4 Cyclic redundancy check 13.4.1 Software example in C 13.5 Registers 13.5.1 Command registers 13.5.2 Non-volatile memory registers 14. Electromagnetic compatibility 14.1 Emission (CISPR 25) 14.1.1 Conducted radio disturbance 14.1.2 Radiated radio disturbance 14.2 Radiated disturbances (ISO 11452-1 third edition (2005-02), ISO 11452-2, ISO 11452-4 and ISO 11452-5) 14.2.1 Absorber lined shielded enclosure 14.2.2 Bulk-current injection 14.2.3 Strip line 14.2.4 Immunity against mobile phones 14.3 Electrical transient transmission by capacitive coupling [ISO 7637-3, second edition (2007-07)] 15. ElectroStatic Discharge (ESD) 15.1 Human body model (AEC-Q100-002) 15.2 Human metal model (ANSI/ESD SP5.6-2009) 15.3 Machine model (AEC-Q100-003) 15.4 Charged-device model (AEC-Q100-011) 16. Application information 17. Test information 17.1 Quality information 18. Marking 19. Terminals 20. Package outline 21. Handling information 22. Solderability information 23. Revision history 24. Legal information 24.1 Data sheet status 24.2 Definitions 24.3 Disclaimers 24.4 Trademarks 25. Contact information 26. Contents