Datasheet ADXL356-EP (Analog Devices) - 5
| Manufacturer | Analog Devices |
| Description | Low Noise, Low Drift, Low Power, 3-Axis MEMS Accelerometer |
| Pages / Page | 9 / 5 — Enhanced Product. ADXL356-EP. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| File Format / Size | PDF / 345 Kb |
| Document Language | English |
Enhanced Product. ADXL356-EP. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter. Rating. Table 3. Thermal Resistance
Model Line for this Datasheet
Text Version of Document
Enhanced Product ADXL356-EP ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit board Acceleration (Any Axis, 0.1 ms) 5000 g (PCB) design and operating environment. Careful attention to VSUPPLY, VDDIO 5.4 V PCB thermal design is required. V1P8ANA, V1P8DIG Configured as Inputs 1.98 V θJA is the natural convection junction to ambient thermal Digital Inputs (RANGE, ST1, ST2, STBY) −0.3 V to VDDIO + 0.3 V resistance measured in a one cubic foot sealed enclosure. Analog Outputs (XOUT, YOUT, ZOUT, TEMP) −0.3 V to V1P8ANA + 0.3 V Operating Temperature Range −55°C to +125°C
Table 3. Thermal Resistance
Storage Temperature Range −65°C to +150°C
Package Type θJA Unit
Stresses at or above those listed under Absolute Maximum E-14-11 42 °C/W Ratings may cause permanent damage to the product. This is a 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board with four thermal vias. See JEDEC JESD51. stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational
ESD CAUTION
section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 5 of 9 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
Thermal performance is directly linked to printed circuit board Acceleration (Any Axis, 0.1 ms) 5000 g (PCB) design and operating environment. Careful attention to VSUPPLY, VDDIO 5.4 V PCB thermal design is required. V1P8ANA, V1P8DIG Configured as Inputs 1.98 V θJA is the natural convection junction to ambient thermal Digital Inputs (RANGE, ST1, ST2, STBY) −0.3 V to VDDIO + 0.3 V resistance measured in a one cubic foot sealed enclosure. Analog Outputs (XOUT, YOUT, ZOUT, TEMP) −0.3 V to V1P8ANA + 0.3 V Operating Temperature Range −55°C to +125°C
Table 3. Thermal Resistance
Storage Temperature Range −65°C to +150°C
Package Type θJA Unit
Stresses at or above those listed under Absolute Maximum E-14-11 42 °C/W Ratings may cause permanent damage to the product. This is a 1 Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board with four thermal vias. See JEDEC JESD51. stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational
ESD CAUTION
section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 5 of 9 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
