Datasheet ADPA7007CHIP (Analog Devices) - 7

ManufacturerAnalog Devices
DescriptionGaAs, pHEMT, MMIC,1 W Power Amplifier, 18 GHz to 44 GHz
Pages / Page25 / 7 — Data Sheet. ADPA7007CHIP. INTERFACE SCHEMATICS. GND. VGG1,. VGG2. VREF. …
File Format / SizePDF / 531 Kb
Document LanguageEnglish

Data Sheet. ADPA7007CHIP. INTERFACE SCHEMATICS. GND. VGG1,. VGG2. VREF. RFOUT. VDET. VDD1 TO VDD4. RFIN

Data Sheet ADPA7007CHIP INTERFACE SCHEMATICS GND VGG1, VGG2 VREF RFOUT VDET VDD1 TO VDD4 RFIN

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Data Sheet ADPA7007CHIP INTERFACE SCHEMATICS GND
003
VGG1, VGG2
21924- 007 21924- Figure 3. GND Interface Schematic Figure 7. VGG1, VGG2 Interface Schematic
VREF
008 004
RFOUT
21924- 21924- Figure 4. VREF Interface Schematic Figure 8. RFOUT Interface Schematic
VDET VDD1 TO VDD4
005 21924- 009 21924- Figure 5. VDET Interface Schematic Figure 9. VDD1 to VDD4 Interface Schematic 006
RFIN
21924- Figure 6. RFIN Interface Schematic Rev. 0 | Page 7 of 25 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS 18 GHz TO 22 GHz FREQUENCY RANGE 22 GHz TO 36 GHz FREQUENCY RANGE 36 GHz TO 44 GHz FREQUENCY RANGE ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ELECTROSTATIC DISCHARGE (ESD) RATINGS ESD Ratings ADPA7007CHIP ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS INTERFACE SCHEMATICS TYPICAL PERFORMANCE CHARACTERISTICS CONSTANT IDD OPERATION THEORY OF OPERATION APPLICATIONS INFORMATION MOUNTING AND BONDING TECHNIQUES FOR MILLIMETERWAVE GAAS MMICS Handling Precautions Mounting Wire Bonding BIASING ADPA7007CHIP WITH THE HMC980LP4E APPLICATION CIRCUIT SETUP LIMITING VGATE FOR ADPA7007CHIP VGGx ABSOLUTE MAXIMUM RATING REQUIREMENT HMC980LP4E BIAS SEQUENCE Power-Up Sequence Power-Down Sequence CONSTANT DRAIN CURRENT BIASING vs. CONSTANT GATE VOLTAGE BIASING TYPICAL APPLICATION CIRCUIT ASSEMBLY DIAGRAM OUTLINE DIMENSIONS ORDERING GUIDE